1) photocurable polyimide
光固化聚酰亚胺
2) low temp cured PI
低温固化型聚酰亚胺
3) thermosetting polyimide
热固性聚酰亚胺
1.
Thermosetting polyimides are being developed for use as matrix resins in structurally efficient advanced composites in aircraft,electronic/electrical materials for printed circuit board(PCB) and thermal insulation materials.
热固性聚酰亚胺作为一类先进的基体树脂,在航空航天、印制电路板、高温绝缘材料等领域的应用不断扩大。
4) Thermoset polyimide
热固型聚酰亚胺
5) photosensitive polyimide
光敏聚酰亚胺
1.
Synthesis of photosensitive polyimide containing chalcone moiety;
结构型光敏聚酰亚胺的合成研究
2.
Synthesis and characterization of novel photosensitive polyimide;
新型光敏聚酰亚胺的制备与研究
3.
A soluble fluorinated photosensitive polyimide(PSPI) was synthesized by 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride(6FDA) and 1,5-bis(3-aminophenyl-1,4-pentadien-3-one(BAPO) through two-step method.
用4,4’-(六氟亚异丙基)-邻苯二甲酸酐(6FDA)与光敏性二胺1,5-二(氨基苯基)-1,4-戊二烯-3-酮(BAPO)合成新型的可溶性光敏聚酰亚胺(PSPI)。
6) photosensitive polyimides
光敏聚酰亚胺
1.
This paper introduces the main types and synthesis methods of photosensitive polyimides.
光敏聚酰亚胺以其优良的性能在许多高新技术领域中得到了广泛的应用,是当今材料科学研究的热点之一。
2.
The new ideas of preparation for novel photosensitive polyimides are brought out in this paper based on PSPIs in the markets through molecular design.
光敏聚酰亚胺(PSPI)具有高耐热性、良好的电绝缘性、优异的机械和感光性能等,被认为是极具应用前景的光电功能材料,已成为新型功能高分子材料的研究热点。
3.
In this paper,the photosensitive mechanism,synthesis method,and properties of negative auto photosensitive polyimides were reviewed in detail,and the improved methods for properties were introduced.
本文综述了一种新型光致抗蚀剂———负性自增感光敏聚酰亚胺的研究概况，着重论述了它的合成方法、感光机理、感度及其影响因素，以及新型二酐和二胺单体的开发情况。
补充资料：光固化
分子式：
CAS号：
性质：指单体、低聚体或聚合体基质在光诱导下的固化过程。一般用于成膜过程。
CAS号：
性质：指单体、低聚体或聚合体基质在光诱导下的固化过程。一般用于成膜过程。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条