研磨粒,abrasive grain,在线英语词典,英文翻译,专业英语

1) abrasive grain

研磨粒

2) abrasive grains

研磨粒

3) magnetic abrasive particles

磁性研磨粒子

4) grinding

研磨

Fractal model for particle-size distribution of coal grinding;

基于分形方法的煤炭研磨颗粒粒度分布模型

Preparation of γ-Fe_2O_3 Nanoparticles by Solid(wet)-phase Grinding;

γ-Fe_2O_3纳米粒子的(湿)固相研磨法制备研究

The grinding materials and technology for stainless steel;

不锈钢研磨材料及研磨工艺

5) Lapping

研磨

Rapid detection of subsurface damage of optical materials in lapping process and its influence regularity;

光学材料研磨亚表面损伤的快速检测及其影响规律

Research on high speed lapping paraboloid workpiece based on bending and forming method;

基于弯曲成形法抛物面高速研磨的研究

Research on the Lapping Uniformity of Uncertain Eccentricity Plane Lapping;

不定偏心平面研磨均匀性的研究

6) polishing

研磨

Polishing Robot System and the Control of Its Motion;

研磨机器人系统及其运动控制

A new way of polishing is discussed, in which the ultrasonic energy is applied to the interface of mechanical polishing and correlative equipment and experimental equipment are designed.

为了提高光纤连接器端面的加工效率和加工质量,改善连接器光传输性能,探讨了在机械研磨的界面上引入超声能的复合研磨方式,设计了相应的超声机械研磨装置。

To improve the material removal rate(MRR),this paper discussed a new ultrasonic polishing in which the ultrasonic energy was introduced to the interface of common polishing,and compared this new polishing process with the common polishing process in the MRR.

为了提高机械研磨的材料去除率,探讨了在机械研磨的界面上引入超声能的复合研磨方式,将机械研磨和引入超声的复合研磨两种方法的去除效率进行了实验对比;发现复合研磨后,去除效率有显著提高;得出超声/机械复合研磨的加工效率明显优于机械研磨。

7) grind

研磨

Siemens S7-300 PIc In Paper making Grinding Production Line Application;

西门子S7-300 PLC在造纸研磨生产线中的应用

The applications of the different grinding media in the grind of ink were summarized in this pa- per.

介绍不同的研磨介质在油墨中的应用,并讨论了研磨介质的种类,体积比及尺寸对基料细度的影响。

The grind renovation processes of rough grind,fine grind and polishing are analyzed.

介绍拉丝模模坯、模套的加工及模芯装镶过程中应注意的要点 ;给出拉丝模修复常用研磨剂的特性和应用范围 ,比较了几种研磨剂研磨效率 ;分析粗磨、细磨和精磨、抛光的研磨修复工

8) rubbing

研磨

Finishing treatment of plating deposit and conversion coating—drawing, rubbing and double-color treatment;

镀层及转化膜的精饰处理──拉丝、研磨及双色处理

In order to improve machining precision and rubbing efficiency of HIPSN( Hot - Isostatic Pressed Silicon Nitride) ceramic ball and to reduce its rubbing cost, a new rubbing method of ceramic ball, called Taper Rubbing, was developed.

为了提高热等静压氮化硅(HIPSN)陶瓷球的研磨效率和精度,降低其研磨成本,本文设计和研制了一种新的陶瓷球研磨方法--锥形研磨法;探讨了该方法下陶瓷球表面研磨迹线的分布规律。

This paper introduces the progress of MRF rubbing technology, its principle of application and key technique.

介绍了磁流变研磨技术的发展、应用原理及关键技术,讨论了磁流变抛光液的制备及其性能对磁流变研磨工艺的影响。

9) grind

(研)磨

10) grinding

(研)磨

补充资料：磁性材料2．薄膜磁性材料

磁性材料2．薄膜磁性材料
Magnetie Materials 2.Thin Film

在一定外加磁场作用下，其反磁化畴(磁矩取向与外磁场方向相反的畴)变为圆柱形磁畴。从膜面上看，这些柱形畴好像浮着的一群圆泡，故称磁泡或叫泡踌(另见磁性材料2.昨晶态磁性材料)。在特定的电路图形、电流方向和一定磁场情况下，可做到控制材料中磁泡的产生、传翰和消失，实现信息的储存和逻辑运算的功能。磁泡的直径在微米量级(0 .5~5协m)，每个磁泡的迁移率在1 .26~12.6em八s·A/m)〔 102一i03cm八s·oe)〕，因而可制成存储密度为兆位/cmZ(Mbit/cmZ)和数据处理速率为兆位/s(M肠t/s)的运算器件。磁泡器件经过近20年研究和开发，已取得广泛的实际应用。对磁泡材料的主要要求是:(l)各向异性常数凡>粤斌，磁化强度从>外磁场强度H;(2)杂质缺陷小，2一~”~’.J泌~-一‘产’~~一~一’、~尹一~~~’J”均匀性好。目前研究得比较清楚的有铁氧体单晶薄膜和稀土一过渡金属薄膜。从制备工艺和性能稳定、器件开发等情况看，以铁氧体磁泡材料比较成熟，早期是用钙钦石型铁氧体单晶片来作磁泡材料，后为YIG单晶薄膜所取代。它是用液相外延法在Gd3Ga5OI:(简称GGO)基片上生成的单晶薄膜，其厚为微米量级。表4为稀土石榴石R3FesolZ的磁性;表5为一些磁泡材料的基本特性数值。农4稀土石抽石R.Fe‘ol，的磁性┌───────────┬────┬────┬────┬────┬────┬────┬────┬────┬─────┬────┬────┐│R │Y │Sm │EU │Gd │Tb │Dy │、Ho │Er │T】11 │Yb │Lu │├───────────┼────┼────┼────┼────┼────┼────┼────┼────┼─────┼────┼────┤│补偿温度，~p，K │ 560 │ 560 │ 570 │ 290 │ 246 │ 220 │ 136 │ 84│41000 ││ │ (ZMHz) │ (20MHz) │└────────┴──────┴────────┘·3.磁光材料呻〕当前所用的磁光材料是利用磁光效应制作的磁性材料。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。

参考词条

研磨条件研磨介质超声研磨公交港湾式车站

研磨;抛光;研磨剂研磨时间磁力研磨研磨工具研磨细度固相研磨
1) abrasive grain 研磨粒 2) abrasive grains 研磨粒 3) magnetic abrasive particles 磁性研磨粒子 4) grinding 研磨 1. Fractal model for particle-size distribution of coal grinding; 基于分形方法的煤炭研磨颗粒粒度分布模型 2. Preparation of γ-Fe_2O_3 Nanoparticles by Solid(wet)-phase Grinding; γ-Fe_2O_3纳米粒子的(湿)固相研磨法制备研究 3. The grinding materials and technology for stainless steel; 不锈钢研磨材料及研磨工艺 5) Lapping 研磨 1. Rapid detection of subsurface damage of optical materials in lapping process and its influence regularity; 光学材料研磨亚表面损伤的快速检测及其影响规律 2. Research on high speed lapping paraboloid workpiece based on bending and forming method; 基于弯曲成形法抛物面高速研磨的研究 3. Research on the Lapping Uniformity of Uncertain Eccentricity Plane Lapping; 不定偏心平面研磨均匀性的研究 6) polishing 研磨 1. Polishing Robot System and the Control of Its Motion; 研磨机器人系统及其运动控制 2. A new way of polishing is discussed, in which the ultrasonic energy is applied to the interface of mechanical polishing and correlative equipment and experimental equipment are designed. 为了提高光纤连接器端面的加工效率和加工质量,改善连接器光传输性能,探讨了在机械研磨的界面上引入超声能的复合研磨方式,设计了相应的超声机械研磨装置。 3. To improve the material removal rate(MRR),this paper discussed a new ultrasonic polishing in which the ultrasonic energy was introduced to the interface of common polishing,and compared this new polishing process with the common polishing process in the MRR. 为了提高机械研磨的材料去除率,探讨了在机械研磨的界面上引入超声能的复合研磨方式,将机械研磨和引入超声的复合研磨两种方法的去除效率进行了实验对比;发现复合研磨后,去除效率有显著提高;得出超声/机械复合研磨的加工效率明显优于机械研磨。 7) grind 研磨 1. Siemens S7-300 PIc In Paper making Grinding Production Line Application; 西门子S7-300 PLC在造纸研磨生产线中的应用 2. The applications of the different grinding media in the grind of ink were summarized in this pa- per. 介绍不同的研磨介质在油墨中的应用,并讨论了研磨介质的种类,体积比及尺寸对基料细度的影响。 3. The grind renovation processes of rough grind,fine grind and polishing are analyzed. 介绍拉丝模模坯、模套的加工及模芯装镶过程中应注意的要点 ;给出拉丝模修复常用研磨剂的特性和应用范围 ,比较了几种研磨剂研磨效率 ;分析粗磨、细磨和精磨、抛光的研磨修复工 8) rubbing 研磨 1. Finishing treatment of plating deposit and conversion coating—drawing, rubbing and double-color treatment; 镀层及转化膜的精饰处理──拉丝、研磨及双色处理 2. In order to improve machining precision and rubbing efficiency of HIPSN( Hot - Isostatic Pressed Silicon Nitride) ceramic ball and to reduce its rubbing cost, a new rubbing method of ceramic ball, called Taper Rubbing, was developed. 为了提高热等静压氮化硅(HIPSN)陶瓷球的研磨效率和精度,降低其研磨成本,本文设计和研制了一种新的陶瓷球研磨方法--锥形研磨法;探讨了该方法下陶瓷球表面研磨迹线的分布规律。 3. This paper introduces the progress of MRF rubbing technology, its principle of application and key technique. 介绍了磁流变研磨技术的发展、应用原理及关键技术,讨论了磁流变抛光液的制备及其性能对磁流变研磨工艺的影响。 9) grind (研)磨 10) grinding (研)磨补充资料：磁性材料2．薄膜磁性材料磁性材料2．薄膜磁性材料 Magnetie Materials 2.Thin Film 在一定外加磁场作用下，其反磁化畴(磁矩取向与外磁场方向相反的畴)变为圆柱形磁畴。从膜面上看，这些柱形畴好像浮着的一群圆泡，故称磁泡或叫泡踌(另见磁性材料2.昨晶态磁性材料)。在特定的电路图形、电流方向和一定磁场情况下，可做到控制材料中磁泡的产生、传翰和消失，实现信息的储存和逻辑运算的功能。磁泡的直径在微米量级(0 .5~5协m)，每个磁泡的迁移率在1 .26~12.6em八s·A/m)〔 102一i03cm八s·oe)〕，因而可制成存储密度为兆位/cmZ(Mbit/cmZ)和数据处理速率为兆位/s(M肠t/s)的运算器件。磁泡器件经过近20年研究和开发，已取得广泛的实际应用。对磁泡材料的主要要求是:(l)各向异性常数凡>粤斌，磁化强度从>外磁场强度H;(2)杂质缺陷小，2一~”~’.J泌~-一‘产’~~一~一’、~尹一~~~’J”均匀性好。目前研究得比较清楚的有铁氧体单晶薄膜和稀土一过渡金属薄膜。从制备工艺和性能稳定、器件开发等情况看，以铁氧体磁泡材料比较成熟，早期是用钙钦石型铁氧体单晶片来作磁泡材料，后为YIG单晶薄膜所取代。它是用液相外延法在Gd3Ga5OI:(简称GGO)基片上生成的单晶薄膜，其厚为微米量级。表4为稀土石榴石R3FesolZ的磁性;表5为一些磁泡材料的基本特性数值。农4稀土石抽石R.Fe‘ol，的磁性┌───────────┬────┬────┬────┬────┬────┬────┬────┬────┬─────┬────┬────┐│R │Y │Sm │EU │Gd │Tb │Dy │、Ho │Er │T】11 │Yb │Lu │├───────────┼────┼────┼────┼────┼────┼────┼────┼────┼─────┼────┼────┤│补偿温度，~p，K │ 560 │ 560 │ 570 │ 290 │ 246 │ 220 │ 136 │ 84│41000 ││ │ (ZMHz) │ (20MHz) │└────────┴──────┴────────┘·3.磁光材料呻〕当前所用的磁光材料是利用磁光效应制作的磁性材料。说明：补充资料仅用于学习参考，请勿用于其它任何用途。参考词条研磨条件研磨介质超声研磨公交港湾式车站
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