1) grinding condition
研磨条件
1.
It is put forward that the grinding quality of fine cutting tools can be evaluated comprehensively with micro-features and parameters of the blade near point, and influences of grinding condition and material texture on the point appearance are analyzed.
为探讨硬质合金刀具的研磨特性,对8种硬质合金刀片研磨后的刀刃状态进行了对比试验研究,提出利用刀尖附近切削刃的微特征及参数来综合评价薄层切削刀具的修磨质量,并分析了研磨条件和材料金相组织对刀尖状态的影响。
2) grinding
研磨
1.
Fractal model for particle-size distribution of coal grinding;
基于分形方法的煤炭研磨颗粒粒度分布模型
2.
Preparation of γ-Fe_2O_3 Nanoparticles by Solid(wet)-phase Grinding;
γ-Fe_2O_3纳米粒子的(湿)固相研磨法制备研究
3.
The grinding materials and technology for stainless steel;
不锈钢研磨材料及研磨工艺
3) Lapping
研磨
1.
Rapid detection of subsurface damage of optical materials in lapping process and its influence regularity;
光学材料研磨亚表面损伤的快速检测及其影响规律
2.
Research on high speed lapping paraboloid workpiece based on bending and forming method;
基于弯曲成形法抛物面高速研磨的研究
3.
Research on the Lapping Uniformity of Uncertain Eccentricity Plane Lapping;
不定偏心平面研磨均匀性的研究
4) polishing
研磨
1.
Polishing Robot System and the Control of Its Motion;
研磨机器人系统及其运动控制
2.
A new way of polishing is discussed, in which the ultrasonic energy is applied to the interface of mechanical polishing and correlative equipment and experimental equipment are designed.
为了提高光纤连接器端面的加工效率和加工质量,改善连接器光传输性能,探讨了在机械研磨的界面上引入超声能的复合研磨方式,设计了相应的超声机械研磨装置。
3.
To improve the material removal rate(MRR),this paper discussed a new ultrasonic polishing in which the ultrasonic energy was introduced to the interface of common polishing,and compared this new polishing process with the common polishing process in the MRR.
为了提高机械研磨的材料去除率,探讨了在机械研磨的界面上引入超声能的复合研磨方式,将机械研磨和引入超声的复合研磨两种方法的去除效率进行了实验对比;发现复合研磨后,去除效率有显著提高;得出超声/机械复合研磨的加工效率明显优于机械研磨。
5) grind
研磨
1.
Siemens S7-300 PIc In Paper making Grinding Production Line Application;
西门子S7-300 PLC在造纸研磨生产线中的应用
2.
The applications of the different grinding media in the grind of ink were summarized in this pa- per.
介绍不同的研磨介质在油墨中的应用,并讨论了研磨介质的种类,体积比及尺寸对基料细度的影响。
3.
The grind renovation processes of rough grind,fine grind and polishing are analyzed.
介绍拉丝模模坯、模套的加工及模芯装镶过程中应注意的要点 ;给出拉丝模修复常用研磨剂的特性和应用范围 ,比较了几种研磨剂研磨效率 ;分析粗磨、细磨和精磨、抛光的研磨修复工
6) rubbing
研磨
1.
Finishing treatment of plating deposit and conversion coating—drawing, rubbing and double-color treatment;
镀层及转化膜的精饰处理──拉丝、研磨及双色处理
2.
In order to improve machining precision and rubbing efficiency of HIPSN( Hot - Isostatic Pressed Silicon Nitride) ceramic ball and to reduce its rubbing cost, a new rubbing method of ceramic ball, called Taper Rubbing, was developed.
为了提高热等静压氮化硅(HIPSN)陶瓷球的研磨效率和精度,降低其研磨成本,本文设计和研制了一种新的陶瓷球研磨方法--锥形研磨法;探讨了该方法下陶瓷球表面研磨迹线的分布规律。
3.
This paper introduces the progress of MRF rubbing technology, its principle of application and key technique.
介绍了磁流变研磨技术的发展、应用原理及关键技术,讨论了磁流变抛光液的制备及其性能对磁流变研磨工艺的影响。
参考词条
补充资料：Anglelapping角度研磨
angle lapping 的目的是为了测量junction的深度，所作的芯片前处理，这种采用光线干涉测量的方法就称之angle lapping。公式为xj=λ/2 nf即junction深度等于入射光波长的一半与干涉条纹数之乘积。但渐渐的随着vlsi组件的缩小，准确度及精密度都无法因应。如srp(spreading resistance prqbing)也是应用angle lapping的方法作前处理，采用的方法是以表面植入浓度与阻值的对应关系求出junction的深度，精确度远超过入射光干涉法。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。