1) package(d) circuit
封装电路，浇注电路
2) package circuit
浇注电路
3) printing of electronic packages
电路封装
1.
Uniform metal droplet stream can be used in powder metallurgy,uniform metal coatings,printing of electronic packages and rapid prototyping of metal structural components, which will enjoy good market prospect.
金属均匀液滴束流可应用于粉末冶金、材料合金薄层涂敷、电路封装和金属零件的快速成形等,具有广阔的市场应用前景。
4) Microcircuit packaging
微电路封装
5) packaged electronic circuits
封装式电子电路
6) IC package
集成电路封装
1.
Based on the progress of technology in IC and the development of IC package,the key steps of IC package,as well as the rules of developing are found out by means of consideration of internal and external factors.
本文结合了集成电路技术的进步 ,通过对集成电路封装发展的探索 ,找出了其中的关键步骤 ,提出了发展中的内外因素 ,摸索其规律 ,并作出了封装今后发展趋势的设
补充资料：浇注
把金属熔液、混凝土等注入（模型等）。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条