1.
Terminology of packages for semiconductor integrated circuits
GB/T14113-1993半导体集成电路封装术语
2.
Electrical Simulation Research for IC Package Via
集成电路封装基板过孔电学仿真技术研究
3.
Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;
集成电路封装用新型Al-1%Si键合线的研制
4.
The Design of Auto-inspection System of IC Package Quality;
集成电路封装质量自动检测系统的设计
5.
The Company's primary business is IC component packaging and test and memory module assembly.
公司的主要业务是集成电路封装测试和内存模块装配。
6.
The usual shapes and lengths of tin whisker in electronic integrated circuit (ECI) encapsulation industry were introduced.
介绍了电子集成电路封装行业中常见的锡须的形状及长度。
7.
Cost Management Mode and Its Application in IC Assembly and Test Enterprises;
集成电路封装测试企业成本管理模式及应用研究
8.
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
GB/T14862-1993半导体集成电路封装结到外壳热阻测试方法
9.
Preparation of Advanced Electronic Packaging Complex Material-Cu/ZrW_2O_8;
先进集成电路封装复合材料—Cu/ZrW_2O_8制备技术的研究
10.
Study on Capacity Improvement of Semiconductor Assembly and Test Factory;
半导体集成电路封装测试工厂生产能力提升研究
11.
Flowability Analysis of the Epoxy Molding Composite used for the Packaging of Large-Scale Integrated Circuit
大规模集成电路封装用环氧树脂复合材料流动性影响分析
12.
Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-ray tubes and nanoCT
纳米焦点X射线管和纳米CT检测集成电路封装中的微型互联(英文)
13.
Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging
六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃
14.
upside-down mounting
倒装法 -集成电路组装的
15.
In relation to an integrated circuit;a term that indicates small element size and high packing density.
集成电路技术中的一种修饰术语，表示元件体积小而且封装密度高。
16.
Semiconductor integrated circuits--Specification for stamped lead frames of plastic DIP
GB/T14112-1993半导体集成电路塑料双列封装冲制型引线框架规范
17.
Robotics Ball Attachment Workcell for Ball Grid Array Semiconductor Packages;
用于集成电路球栅阵列（BGA）封装的全自动植球机的研制开发
18.
hybrid microassembly
混合集成电路微组装