SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years.

By using the Laplace transformation and Simulink, the dynamic characteristics of product under a varies of inputs and drop process are analyzed.

The results showed that the damage boundary differs as the orientation changes,and even when the cookies are dropped in the same orientation,the damage rate is not identical.

The design of the dropping tester for simple packages;

The properties of the molded pulp cushion were investigated through the vibration and dropping experiments of the signal acquisition instrument package.

Smoothed particle hydrodynamics (SPH) method coupled with finite element method (FEM) is used to simulate the dropping of rectangular fluid-filled tank.

A 3-D FE model was established in order to investigate dynamic responses of the round PCB and find the weakness of solder joint in packaging under drop impact.

With increase in electronic package density,the reliability of a board-level package under drop impact load becomes a key issue.

Drop direction is an important parameter of drop impact,this paper presented a new method to measure drop direction and introduced the basic structure,measurement circuit and principle of the sensor.

By measuring strength of three kinds of processed briquettes of Jincheng,Jiyuan,Yancheng anthracite,the influence rules that the factors influenced fall strength of briquette are pointed out in this paper.