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1)  scanning Auger microprobe
扫描俄歇电子微探针
2)  Scanning Auger Microprobe
扫描俄歇微探针
1.
Based on the kinetics of interfacial reaction in C/A1 composi-te materials established in reference [1], the kinetics of interfacial reac-tion zone is measured by Scanning Auger Microprobe Depth Profile for simulated C/Al-Ti and C/Al-Cu specimens subjected to various annealing procedures.
在文献[1]所建立的C/Al复合材料界面反应动力学的基础上,利用扫描俄歇微探针深度分析测量了不同退火工艺的模拟C/Al-Ti和C/Al-Cu样品界面反应层的厚度,求得相应的界面反应激活能,并确定了界面反应从慢到快的顺序为C/Al-Ti、C/Al-Cu和C/Al。
3)  scanning auger microprobe
扫描式俄歇微型探针
4)  SAM [英][sæm]  [美][sæm]
扫描俄歇探针
1.
The effect of cooling rate on mechanical properties of 95W Ni Fe alloy in sintered and vacuum heat treated states has been researched by using Scanning Auger Microprobe (SAM) combined with technological tests.
用扫描俄歇探针 ( SAM)结合工艺试验研究了烧结态和经真空热处理的 95W-Ni-Fe合金冷却速度对其性能的影响。
2.
Scanning Auger Microprobe(SAM)and the metallographic method have been used to study the nature of bright lines and spots on fracture surfaces of electroslag remelted 35CrNi3MoV steel and the mechanism of their formation.
用扫描俄歇探针和金相法研究了电渣熔铸35CrNi3MoV钢断口上亮线、亮点的本质和形成机理。
3.
The embrittling mechanism of 95W - Ni - Fe alloy has been researched by using Scanning Auger Microprobe(SAM) combined with heat treatment in vacuum.
用扫描俄歇探针(SAM)结合真空热处理试验,研究了95W-Ni-Fe合金的脆化 机理,发现烧结态合金中散布着氧的高浓度富集区,这是钨合金脆化的重要因素。
5)  Auger scanning microscopy
俄歇扫描电子显微术
6)  Auger electron microprobe
俄歇电子探针
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