The study on the optimizational technology of the large area free-standing diamond films mechanical polishing;

This paper introduced a precision polishing experiment study on H62(φ80mm)brass with traditional precision mechanical polishing method.

On the basis of briefly reviewing the polishing process techniques of chemically vapor deposited diamond films,an primary investigation on mechanical polishing processes for chemically vapor deposited diamond thick films was carried out using automatic polishing, as well as during polishing process, were observed by means of scanning electron microscope.

Presents a sequence of order-of-magnitude calculations based on the concepts of chemical kinetics and transport phenomena during the chemical mechanical polishing(CMP) process.

Slurry flow weighs heavily on the performances of chemical mechanical polishing(CMP) process,wherein the pad surface will alter the flow features considerably.

For high-quality and high-efficiency chemical mechanical polishing(CMP) of multilayer interconnection in ultralarge-scale integrated(ULSI) circuit,the silica sol nano-abrasive with large-particle and lowpolydispersition was prepared by polymerization growth technique with control of constant liquid level.