1) tin soldering
锡焊
1.
That is satisfied for tin soldering and the technological operation was simple and efficient.
采用正交设计试验方法,对铝合金表面电镀前处理工艺进行了优化改进,并在LY12铝合金表面实现了电刷镀铜工艺,所得刷镀铜层与基体结合强度高,满足锡焊连接质量要求。
2) soldering tin
焊锡
1.
Study on soldering tin and through current capability of ring SrTiO_3 double function component;
环形SrTiO_3双功能元件的焊锡和通流能力研究
2.
This paper introduces briefly the structural improvements of the clamp apparatus of soldering tin of loop, offers not only the exact patterns and sizes of the subject picture, the indene board picture, the cover board picture and the assembly picture, but also the comparison of the results before and after the improvements.
该文对线圈焊锡夹具的结构的改进作了简要介绍 ,给出了夹具主体图、侧板图、盖板图、装配图的具体式样和尺寸 ,并对改进前后的效果进行了对
3.
Shrinked aldehyde drying glue and soldering tin is two kinds of adhesive materials used for adhibiting and fixing the pieces of ferrite on the inner wall of the shell of microwave ferrite devices.
缩醛烘干胶和焊锡是微波铁氧体器件中常用的两种粘接材料,用于铁氧体片在器件壳体内壁既定位置上的固定。
3) solder
[英]['səʊldə(r)] [美]['sɑdɚ]
焊锡
1.
Effect of bubble in solder on heat transfer of electronic components;
焊锡中气泡对电子元件热传导的影响
2.
This paper preliminarily made an approach to the influence of adding trace Bi and Sb on the solder-ability of 60 tin-lead solder with the most simple and easy to apply and economic capillary elevation test.
本文采用可焊性能测定中,最简单、方便易行又经济的毛细上升试验方法初步探讨了60焊锡中加入少量Bi、Sb后对可焊性的影响。
3.
A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid- sulfonic acid type tin stripper.
以硝酸-磺酸型退锡剂为基础配方,研制了一种脱除废旧电路板表面残留焊锡的剥离液。
5) solder
[英]['səʊldə(r)] [美]['sɑdɚ]
焊料;焊锡
6) soldering
[英]['sɔldə] [美]['sɑdɚ]
软焊，锡焊
补充资料：焊锡
分子式：
CAS号：
性质：熔点较低的焊料。主要指用锡基合金做的焊料。熔融法制锭，压力加工成材
CAS号：
性质：熔点较低的焊料。主要指用锡基合金做的焊料。熔融法制锭，压力加工成材
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条