Study on heat treatment process of C194 copper alloy for lead frame;

Development of Cu-Ni-Si alloy for lead frame;

Microstructure and properties of Cu-Ni-Si based alloys for lead frame;

When the leadframe made of 4J42 alloy is brazed to the brazing zone of an alumina substrate using an AgCu28 filler in ceramic DIP production, the liquid filler often flows onto the surface of the leadframe after brazing, and the quality of finished products is influenced greatly.

Inthispaper,themicrostructuresandtheirchangesinhightemperatureoftheinterfacesbetweenfourcivilcopperalloysforleadframeandSn -Pbsolderalloysarestudied .

It was discussed the leadframe driving structure moving along line intermittently, especially the principle of the 3D cam in the designed die bonder.

Effect of Rare Earth on Oxidation Performance of Cu Alloys for Lead-frame;

The simulation results show that parameters such as material,shape and the thickness of the lead-frame have immediate effects on the thermal performance.

With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity for lead frame materials.

The Effect of lead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy.