Every step of the process for producing C194 alloy for lead frame is studied and analyzed with the result that suggestions and references for producing high quality C194 alloy for lead frame are provided.

With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity for lead frame materials.

The Effect of lead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy.

With the development of IC to high density,multifunction and miniaturization,the amount of lead increase,and lead pitch space decreases,which demand high strength and excellent punchability for leadframe materials.

The current status of research on lead frame materials used in integrated circuit is summarized in this paper.

KFC copper alloy is one of the representative lead frame materials with good electric conductivity.

Lead frame materials play a very important role in IC.

Study on heat treatment process of C194 copper alloy for lead frame;

Development of Cu-Ni-Si alloy for lead frame;

Microstructure and properties of Cu-Ni-Si based alloys for lead frame;