Study on soldering tin and through current capability of ring SrTiO_3 double function component;

This paper introduces briefly the structural improvements of the clamp apparatus of soldering tin of loop, offers not only the exact patterns and sizes of the subject picture, the indene board picture, the cover board picture and the assembly picture, but also the comparison of the results before and after the improvements.

Shrinked aldehyde drying glue and soldering tin is two kinds of adhesive materials used for adhibiting and fixing the pieces of ferrite on the inner wall of the shell of microwave ferrite devices.

Effect of bubble in solder on heat transfer of electronic components;

This paper preliminarily made an approach to the influence of adding trace Bi and Sb on the solder-ability of 60 tin-lead solder with the most simple and easy to apply and economic capillary elevation test.

A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid- sulfonic acid type tin stripper.