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1)  silicon ingot
硅单晶锭
1.
This paper introduces one measuring method for the silicon ingot based on the X-ray diffraction principle,and the measuring model was set up simultaneous.
本文介绍了一种基于X射线衍射原理的半导体材料—硅单晶锭的加工测量方法,建立了硅单晶锭的测量模型。
2)  multi-crystal silicon ingot
多晶硅锭
1.
The content of oxygen,carbon and metal impurities in the remelted material was analyzed so as to find out if the pot material could be used as the feedstock to produce multi-crystal silicon ingot for solar cell.
试验发现通过重熔可以将单晶硅埚底料中的石英与硅料分离,重熔后得到的硅片中氧含量比较高,而金属杂质含量基本可达到太阳电池多晶硅锭的生产要求。
3)  monocrystalline ingot
单晶锭块
4)  polysilicon ingot furnace
多晶硅铸锭炉
1.
In this paper,we briefly discussed the working principle and structure composition of polysilicon ingot furnace using solar cells,also we mainly introduced the lifting devices of polysilicon ingot furnace door and the structural design of thermal shield frame s lifting device.
简要认识了太阳能电池用多晶硅铸锭炉的工作原理及结构组成。
2.
Temperature Control System Based on Differential ahead PID Algorithm of Polysilicon Ingot Furnace
针对多晶硅铸锭炉的温度控制,提出了一种基于微分先行算法的PID控制方法。
5)  seed of single crystal silicon
单晶硅籽晶
6)  single-crystal silicon
单晶硅
1.
The micro-tribological and nano-mechanic properties of Ar~+ implanted single-crystal silicon were investigated by using a Micro-tribology Text and a Nano Indenter System, The results show that Ar~+ implantation of single-crystal silicon had increased the wear-resistance, the best dose is 1×10~(16) ions /cm~2.
利用离子注入技术对单晶硅表面进行了氩离子注入,用微摩擦磨损实验机研究了改性层的摩擦磨损行为,并用透射电子显微镜研究了改性层的微观结构。
2.
In Chemical-Mechanical polishing experiments we produced optical quality super smooth surfaces on single-crystal silicon, but cannot insure the surface figure.
使用机械 -化学抛光法加工大尺寸单晶硅可获超光滑表面 ,但很难保证良好的面型。
3.
The nano-scratch behaviors of Ar+ implanted single-crystal silicon were investigated by a nano indenter system, the micro-structure of the implanted layer was analyzed with TEM.
通过离子注入技术对单晶硅表面进行氩离子注入处理,利用纳米压痕仪及其附件研究了单晶硅表面在离子注入前,后的微观力学性能和变形机理,并用透射电子显微镜研究了改性层的微观结构。
补充资料:直径6英寸硅单晶及单晶炉


直径6英寸硅单晶及单晶炉


  巍 户亡‘砚.士释L朴品及沪晶护万引门l
  
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