Texture and grain boundary character distribution of Cu interconnects with different line width for as-deposited and annealed conditions were measured by EBSD.

Microstructure of Cu interconnects and blanket films were analyzed by using TEM、SEM、XRD and EBSD.

Improved delay estimation method for RLC interconnects;

Modeling of RF Coupled Interconnects on Lossy Silicon Substrates;

Exploiting clock circuit dynamical optimization using RLC interconnect model;

Finally,a method of building the Spice model with high-frequency interconnection line in the substrate is proposed,thus providing a foundation for coordination design of chip package.

In this case, interconnection lines between the chips in the Multi-Chip Module (MCM) or Printed Circuit Board (PCB) have become the important factors of the signal integrity and entire system performance.

Design and Implementation of 3D Interconnections Capacitance Extraction;

This paper introduced copper as substitute for aluminum as the metal interconnection with its low resistance rate and high resist-electron migration ability, briefed on the preparation techniques of Cu, and then discussed the new disfigurement and its solution such as groove disfigurement, bubble disfigurement and metal loosing disfigurement.

Considering the serious RC network effects of interconnections in very high speed digital ICs, the parasitic parameters of the interconnections with TSMC 0.