1) RC-interconnect
RC互连线
2) coupling RC interconnect
耦合RC互连
1.
An approach for analyzing coupling RC interconnect delay based on “effective capacitance” is presented.
基于“有效电容”的概念提出了一种分析两相邻耦合RC互连延时的方法。
3) interconnect
[英][,ɪntəkə'nekt] [美]['ɪntɚkə'nɛkt]
互连线
1.
Improved delay estimation method for RLC interconnects;
改进的RLC互连线延时估算方法
2.
Modeling of RF Coupled Interconnects on Lossy Silicon Substrates;
射频高损耗硅基双互连线建模
3.
Exploiting clock circuit dynamical optimization using RLC interconnect model;
用RLC互连线模型实现时钟电路的动态优化
4) interconnection line
互连线
1.
Finally,a method of building the Spice model with high-frequency interconnection line in the substrate is proposed,thus providing a foundation for coordination design of chip package.
根据二端口等效电路理论,提出了建立基板高频互连线Spice模型的方法,为芯片-封装协同设计提供了依据。
2.
In this case, interconnection lines between the chips in the Multi-Chip Module (MCM) or Printed Circuit Board (PCB) have become the important factors of the signal integrity and entire system performance.
在现代高性能集成电路中,由于亚微米和深亚微米技术的发展,器件和单元电路的尺寸越来越小,由寄生参数引起的影响不大,而此时芯片中的单元电路间、印刷电路板(PCB)及多芯片组件(MCM)的各块芯片间的互连线的电长度较大,将会引起相当严重的寄生效应。
5) interconnection
[英][,intəkə'nekʃən] [美][,ɪntɚkə'nɛkʃən]
互连线
1.
Design and Implementation of 3D Interconnections Capacitance Extraction;
三维互连线寄生电容提取算法的设计和实现
2.
This paper introduced copper as substitute for aluminum as the metal interconnection with its low resistance rate and high resist-electron migration ability, briefed on the preparation techniques of Cu, and then discussed the new disfigurement and its solution such as groove disfigurement, bubble disfigurement and metal loosing disfigurement.
在集成电路中采用双镶嵌工艺制备互连线,铜作为互连线的材料具有低电阻率和较好的抗电迁移能力等优点,同时存在新的缺陷模式如沟槽缺陷、气泡缺陷、金属缺失等,目前的工作主要是该工艺的完善。
3.
Considering the serious RC network effects of interconnections in very high speed digital ICs, the parasitic parameters of the interconnections with TSMC 0.
分析了RC网络效应对超高速集成电路中互连线的影响 ,基于TSMC 0 。
6) Al interconnect
Al互连线
1.
In order to study the failure of IC devices induced by the stress in VLSI metal interconnect, In-situ observation of the stress changes of VLSI Al interconnect was studied under the electromigration and thermal conditions by using a synchrotron radiation x-ray diffraction technique.
为研究VLSI金属互连线的应力导致IC器件失效的问题,采用同步辐射源X射线衍射技术,原位测试了VLSI中Al互连线在电迁徙及加热条件下的应力变化。
补充资料：连线
连线：是指连接上述国内外众多收发货节点的运输连线，如各种海运航线、铁路线、飞机航线以及海、陆、空联合运输线路。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条