1) Multilayer substrate in microwave frequency
多层微波互连基板
2) Multilayer interconnection substrate
多层基板互连
3) microwave multi-layer boards
微波多层板
1.
The performance of the dielectric materials for microwave multi-layer boards (MMB)is introduced in detail.
介绍了微波多层板所用基材的性能参数,重点阐述了材料的介电常数、介质损耗、热胀系数、特性阻抗对多层板性能的影响。
4) microwave multilayer printed circuit board
微波多层印制板
1.
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
5) mutilevel interconnect
多层互连
1.
The importance of CMP in mutilevel interconnect was described,and the process and effect of CMP was analyzed.
介绍了化学机械抛光(CMP)技术在大规模集成电路多层互连工艺[1]中的重要作用,对CMP过程和CMP的影响因素进行简单分析。
6) micro-wave base board
微波基板
1.
The author analyze and compare the dielectric property of many types of micro-wave base board and choose polystyrene copper clad laminate as the base board material of plane micro-wave band aerial.
文章介绍了平面微带天线的结构和其对基板材料的要求,对各种微波基板的介电性能进行了分析比较,选择了聚苯乙烯覆铜板作为家用平面微带天线基板材料,并探讨了聚苯乙烯覆铜板制作工艺路线和研究方向。
补充资料：渤海铝业有限公司铝板坯连铸连轧机生产卷毛料
渤海铝业有限公司铝板坯连铸连轧机生产卷毛料
渤海铝业有限公司铝板坯连铸连轧机生产卷毛制
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条