1) multilayer LTCC substrate
LTCC多层基板
2) LTCC multilayer boards
LTCC多层板
3) LTCC substrate
LTCC基板
1.
By experiments the Ti/Ni is a high reliable barrier metals and also Ti/Ni/Au is an ideal thin-film metalized structure for LTCC substrates.
讨论了LTCC基板薄膜金属化技术中 ,有效阻碍层的选择对基板共晶焊的影响 ,实验结果表明 ,Ti/Ni是一种高可靠性的阻碍层 ,而且Ti/Ni/Au也是一种较理想的LTCC基板薄膜金属化结
2.
With the strong demanding of miniaturization,high-performance,multi-function and high reliability for electronic products,the LTCC substrate which rely on its unique advantage of density assembly,signal transmission speed,electrical property and reliability,will be more widely applied on electronic equipment in the future.
LTCC基板依赖其在组装密度、信号传输速度、电性能及可靠性方面独特的优势,必将在未来的电子装备中得到更广泛的发展。
4) Multi-layer substrate
多层基板
5) multi-layered film substrate(MFS)
多层膜基板
6) Multilayer interconnection substrate
多层基板互连
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条