Through the following research, including the patterning process of mask, the selectivity of mask materials for silicon, the deposition process of passivation layer and the process of silicon anisotropic etching in Time Multiplexed Deep Etching (TMDE), the through-silicon via hole has been achieved.

Study of New Method and Equipment of Combined Machining Based on High Temperature Alloy;

Experimental results show that the variational trend of grinding force and short circuit ratio is similar in ultrasonic vibration aided electrical discharge grinding(UEDG) process,that is,the grinding force and short circuit rate will be increased in the combined machining process.

The chief machining methods of PCD material which is being studied or have been used is presented,which is grinding,lapping,electrical discharge machining,laser processing,chemical processing,ultrasonic machining and combined machining.

The process model and compound machining technologies of PECM are expatiated, and the developing prospect and key research directions of PECM are previewed.

Taking the developing Nanosystem300 aspheric surface compound machining system for an example, this paper pays more attention to the essential problems existing in the developing process of machine tool.

Based on the consultation of a great deal of domestic and overseas latest data,the development of ultra-precision machining technology,the ultra-precision cutting、grinding、 lapping as well as nontraditional ultra-precision machining and compound machining technology are overviewed,the probable further trend of ultra-precision machining is forecasted.