1)  Cu~(2+)/TiO_2-SiO_2
Cu~(2+)/TiO_2-SiO_2
2)  Cu
Cu
1.
Sorption properties of Cu in electroplating wastewater on municipal solid waste incinerator bottom ash;
垃圾焚烧炉渣对电镀废水中Cu的吸附特性
2.
Study on the Influences of Combined Pollution of Heavy Metals Cu and Pb on Soil Respiration;
重金属Cu与Pb复合污染对土壤呼吸影响的研究
3.
BIOACCUMULATION AND TOXICITY OF Cu AND Zn IN HYDRILLA VERTICILLATA(LINN.F.) ROYLE;
Cu、Zn在黑藻叶片中的富集及其毒理学分析
3)  Cu~+
Cu+
1.
Complex ions [Cu(RS)],[Cu(RS)_2]~-and [Cu(RS)_3]~(2-) whose coordination numbers were 1,2 and 3,respectively were formed by the combination of L-cysteine(RSH) in the form of RS~-and Cu~++ in this system.
研究表明,L-半胱氨酸(RSH)以RS-负离子形式和Cu+形成配位数分别为1、2、3的配位离子[Cu(RS)][、Cu(RS)2]-[、Cu(RS)3]2-,它们的稳定常数分别为760,5。
2.
KCl:Cu~++ powder sample was prepared with high temperature solid reaction process.
用固相反应法制备了KCl:Cu+多晶样品。
4)  Cu(Ⅱ)
Cu(Ⅱ)
1.
Study on Complexing of Alkyl Polyamine with Transition Metallic Ion Cu(Ⅱ);
烷基多胺与过渡金属离子Cu(Ⅱ)的络合研究
2.
Electrochemical Oxidation of Selenium Amino Acids and Interaction between Selenium Amino Acids and Au(Ⅲ)/Cu(Ⅱ);
含硒氨基酸电化学氧化及其与Au(Ⅲ)、Cu(Ⅱ)的相互作用
5)  Copper
Cu
1.
Influence of Copper,Lead and Their Interaction on Accumulation of Copper and Lead in Houttuynia cordata Thunb;
Cu·Pb及其交互作用对鱼腥草累积的影响
2.
Influence of pH and organic chelators on desorption of copper from copper-lead complex contaminated soil;
pH和有机配体对Cu-Pb复合污染土壤中Cu的解吸行为的影响
3.
Advances in copper toxicity to plants;
Cu对植物毒害研究进展
6)  Cu~+
Cu~+
1.
Theoretical Study of the Reaction of D-Phenylalanine with Cu~++ (~1S_0, 3d~(10)) in Gas Phase;
D-苯丙氨酸与Cu~+(~1S_0,3d~(10))气相反应理论研究
2.
Synthesis and Spectra Characteristics of Ca_(1-n)_Mg_nS: Cu~++, Eu~(2+)Phosphors;
稀土无机发光材料Ca_(1-n)Mg_nS:Cu~+,Eu~(2+)的合成与光谱特征
参考词条
补充资料:CaO-TiO2-SiO2 ceramics
分子式:
CAS号:

性质:在CaO-TiO2-SiO2三元系统中以CaSiO3与TiO2或以CaTiSiO5与CaTiO3为基料的陶瓷材料。其结构特点是两种晶相共存,性能受晶相比例影响。配比可在一定范围内调节。主要原料为碳酸钙、二氧化钛、二氧化硅,加入少量改性添加剂,经配料、磨细、混合、成型、烧成等工序获得制品,也可先用碳酸钙和二氧化硅高温下合成硅酸钙,用碳酸钙、二氧化硅、二氧化钛高温下合成钛硅酸钙后再进行配料、烧成等,以确保两晶相共存。主要介电性能为:介电常数80~110,介质损耗角正切值(0.8~2.5)×10-4,介电常数温度系数(-450~+550)×10-6/℃。抗电温度(45~55)kV/mm,电阻率(1011~1012)Ω·cm。主要用作温度补偿型陶瓷电容器瓷料。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。