1) Thick Film Conductor Slurry
厚膜导体浆料
2) thick film
厚膜
1.
Preparation and characterization of PZT thick film for piezoelectric cantilever beam by sol-gel;
用于压电悬臂梁的PZT厚膜的溶胶-凝胶制备及表征
2.
Fabrication and investigation of Si-based PZT thick films;
硅基高度择优取向PZT厚膜的制备及性能研究
3.
Study on Integrated Capacitive Pressure Sensor of Thick Film;
电容式压力传感器的厚膜集成化研究
3) thick films
厚膜
1.
Studies on the BaFe_(12)O_(19) ferrite permanent thick films prepared by screen-printing;
丝网印刷制备钡铁氧体永磁厚膜的研究
2.
This article describes the main growth methods of MgB_2 thin/thick films since the superconductivi- ty of MgB_2 had been discovered,including the comparisons of substrates and annealing processes,and summarizes the research progress of fabricating MgB_2 tunnel junctions briefly.
介绍了自 MgB_2超导电性被发现以来,用于制备 MgB_2薄膜/厚膜的各种基片、主要生长方法以及退火工艺,简单概述了薄膜制作超导隧道结方面的研究状况。
3.
The recent progresses on the liquid epitaxial growth of REBCO (RE=rare earth) thick films are reviewed.
本文从基片和种膜、LPE的初始阶段研究和超导性能的控制这三个方面回顾总结了液相外延生长REBCO(RE=稀土元素)厚膜的研究进展。
4) thick-film
厚膜
1.
Development of thick-film intelligent pressure transmitter with low pressure scale;
小量程智能厚膜压力变送器的研制
2.
Applied research of nickel paste in thick-film humidity sensitive resistor;
镍浆在厚膜湿敏电阻器上的应用研究
3.
The linearity of the micro-pressure thick-film sensor;
厚膜微压传感器的线性化
5) Piezoelectric Thick Film
压电厚膜
1.
Studies of PMS-PNN-PT Piezoelectric Thick Film Ceramic Material;
PMS-PNN-PT压电厚膜陶瓷材料的研究
2.
Effects of buffer layer on properties of PMS-PNN-PZT piezoelectric thick film material;
缓冲层对PMS-PNN-PZT压电厚膜材料性能的影响
3.
In this paper,the development of the method for powder synthesis and new preparation technique of ceramic were reviewed,such as sol-gel method,hydrothermal method,molten salt method,piezoelectric thick film techology,spark plasma sintering technology.
本文从粉体制备方法和陶瓷制备新技术两个方面综述了近几年无铅压电陶瓷制备方法(如溶胶-凝胶法、水热法、熔盐法、压电厚膜技术、放电等离子烧结技术等)的研究进展,并对制备出的无铅压电陶瓷的性能与传统方法进行了对比,讨论了不同制备方法的优缺点。
6) thick film paste
厚膜浆料
1.
Review of development on thick film paste for AlN substrate;
AlN基板用厚膜浆料发展评述
参考词条
补充资料：金铂导体浆料
分子式：
CAS号：
性质：是以金铂合金为导电相的厚膜浆料，铂的扩散系数小，因此抗焊料浸蚀能力最优，可与钌系电阻充分兼容，阻值误差可控制在最小限度。铂也增大电阻系数。金铂粉加黏结剂和有机载体混匀研磨而成。导电膜的初始附着力比银铂的低，电阻系数高。用于要求高可靠和高稳定的复杂电路中，作钌系厚膜电阻端头连接等。
CAS号：
性质：是以金铂合金为导电相的厚膜浆料，铂的扩散系数小，因此抗焊料浸蚀能力最优，可与钌系电阻充分兼容，阻值误差可控制在最小限度。铂也增大电阻系数。金铂粉加黏结剂和有机载体混匀研磨而成。导电膜的初始附着力比银铂的低，电阻系数高。用于要求高可靠和高稳定的复杂电路中，作钌系厚膜电阻端头连接等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。