1) Tool encapsulation and integration
工具封装与集成
2) integration and packaging
集成与封装
1.
Finally, this thesis gives a general introduction to the integration and packaging of monolithic microwave micro-plasma source, including block diagram and packaging technology.
最后,本论文对基于MSRR的微波微等离子体源的集成与封装做了一个总体的介绍,包括集成框图和封装工艺,并且给出了等离子体激发以后谐振器反射系数的仿真结果。
3) 3D Integration and Packaging
三维集成与封装
5) tools integration
工具集成
1.
According to the requirement of modeling and simulation tools integration in Virtual Prototype Collaborative Modeling Environment, the application methods of MATLAB were studied and its integration methods were provided in the phases of building and validating simulation models and developing simulation application.
针对虚拟样机协同建模环境对建模仿真工具集成的需求,对典型建模工具MATLAB的应用方法进行研究,提出在虚拟样机协同建模环境中仿真模型的建立、验证以及仿真应用软件开发各个阶段中MATLAB的集成与应用方法。
2.
The multidisciplinary tools integration is one of the key technical problems in the Virtual Prototyping design and simulation on the complex product.
多领域工具集成是复杂产品虚拟样机设计仿真需要解决的技术问题之一。
3.
According to the requirement of modeling and simulation tools integration in MDO environment of SBA system,the integration methods of typical tools (MATLAB/DATCOM) were studied such as COM based integration,MCC methods and MATLAB engine method.
针对SBA系统多学科优化环境构建中各学科分析过程对建模仿真工具集成的需求,研究了。
6) tool integration
工具集成
1.
From the point o f view of that tool integration facilities is separated from tool logic processi ng function, this paper presents a pure model of toolbus based on ObjectOrient ed software bus, then emphasizes to research its basic concepts, function abstra ction, internal structure and interface specifications.
文中在软总线的基础上,从工具集成设施和工具逻辑处理功能相分离的角度,提出了一种抽象的工具总线模型,并对工具总线的基本概念、功能抽象、内部结构、接口规范等方面进行了深入的研究。
补充资料：集成电路的封装缩写形式
BGA（Ball Grid Array）：球栅阵列，面阵列封装的一种
QFP（Quad Flat Package）：方形扁平封装
PLCC（Plastic Leaded Chip Carrier）：有引线塑料芯片栽体
DIP（Dual In-line Package）：双列直插封装
SIP（Single inline Package）：单列直插封装
SOP（Small Out-Line Package）：小外形封装
SOJ（Small Out-Line J-Leaded Package）：J形引线小外形封装
COB（Chip on Board）：板上芯片封装
Flip-Chip：倒装焊芯片
片式元件（CHIP）：片式元件主要为片式电阻、片式电容、片式电感等无源元件。根据引脚的不同，有全端子元件（即元件引线端子覆盖整个元件端）和非全端子元件，一般的普通片式电阻、电容为全端子元件，而像钽电容之类则为非全端子元件。
THT（Through Hole Technology）：通孔插装技术
SMT（Surface Mount Technology）：表面安装技术
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条