1) Copper Clad Laminates
铜箔基板
1.
Research on On-Line Detection System of Copper Clad Laminates Defects Base on Machine Vision Technology;
基于机器视觉技术的铜箔基板缺陷在线检测系统研究
2) copper base copper clad laminate
铜基覆铜箔板
3) ceramics base copper-clad laminates
陶瓷基覆铜箔板
4) printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
5) copper-clad laminate
覆铜箔板
1.
It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin.
概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造。
2.
This paper describes the requirment,characteristic and application of low thermal expansion high elastic modulus glass epoxy copper-clad laminat
概述了低热膨高弹性模量覆铜箔板的必要性、特征和用途。
6) copper-clad laminate
敷铜箔板
补充资料：酚醛纸质覆铜箔层压板
分子式：
CAS号：
性质：由棉浆纸浸渍改性酚醛或阻燃性酚醛树脂经烘焙，单面覆以铜箔、热压、剪切而成。具有良好的介电性能、耐热性、冷冲孔性和自熄性，尺寸稳定性好，翘曲小，价格低廉。适用于电视机、收录机、家用电器中作印制电路板。
CAS号：
性质：由棉浆纸浸渍改性酚醛或阻燃性酚醛树脂经烘焙，单面覆以铜箔、热压、剪切而成。具有良好的介电性能、耐热性、冷冲孔性和自熄性，尺寸稳定性好，翘曲小，价格低廉。适用于电视机、收录机、家用电器中作印制电路板。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条