1) heavy copper cladding printed circuit board
厚铜箔印制板
1.
This article discusses the process of heavy copper cladding printed board,researches the control of key working procedure affecting the manufacture quality of heavy copper cladding printed circuit board.
讨论了厚铜箔印制板的加工工艺,并针对影响厚铜箔印制板质量的关键工艺控制进行了研究探讨。
2) heavy copper multilayer PCB
厚铜箔多层板
3) Copper thickness
铜箔厚度
4) super-thick copper clad laminate
覆超厚铜箔层压板
5) copper-based PCB
铜基印制板
1.
Based on the 14 oz copper lines produced by the copper substrates summary of the trial process,a process to resolve the problems in processing,high-thick copper lines produced by the special copper-based PCB laid the foundation for mass production.
文章通过对14 oz线铜制作的铜基板的加工工艺试验的总结,提出了加工工艺,解决了加工中的难题,为高线铜厚制作的特种铜基印制板的批量生产奠定了基础。
6) printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
补充资料：酚醛纸质覆铜箔层压板
分子式：
CAS号：
性质：由棉浆纸浸渍改性酚醛或阻燃性酚醛树脂经烘焙，单面覆以铜箔、热压、剪切而成。具有良好的介电性能、耐热性、冷冲孔性和自熄性，尺寸稳定性好，翘曲小，价格低廉。适用于电视机、收录机、家用电器中作印制电路板。
CAS号：
性质：由棉浆纸浸渍改性酚醛或阻燃性酚醛树脂经烘焙，单面覆以铜箔、热压、剪切而成。具有良好的介电性能、耐热性、冷冲孔性和自熄性，尺寸稳定性好，翘曲小，价格低廉。适用于电视机、收录机、家用电器中作印制电路板。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条