1) sputtered particles
溅射粒子
2) particle sputtering rate
粒子溅射速率
3) EBIS
二次粒子溅射
4) particle splatting
粒子泼溅
1.
An approach based on smoothed particle hydrodynamics to simulate fluids with free surfaces was proposed, while surface tension was modeled by using Van der Waals equation of state with a combination of short-range repulsive and longer-range attractive interactions between fluid particles, finally a GPU-based particle splatting algorithm was designed for rendering.
提出基于平滑粒子流体力学的自由界面流体模拟方法,采用了范德瓦尔斯方程与粒子间短距离排斥力和长距离吸引力作用的表面张力,设计出基于GPU的粒子泼溅算法。
5) ion sputtering
离子溅射
1.
Application of ion sputtering in plasma nitriding of austenitic stainless steel
离子溅射在奥氏体不锈钢离子渗氮中的应用
2.
Effect of ion sputtering platinum on photocatalytic degradation of ethylene in the environment of cold storage
离子溅射Pt对光催化降解冷藏环境中乙烯的影响
3.
Silicate substrates were coated by ion sputtering with nickel,and then used to catalyze the decomposition of low hydrocarbons to prepare the relatively well distributed carbon nanotubes films(CNFs).
1 实验部份1 1 镀膜与后处理采用离子溅射法在硅酸盐基板上镀镍,镀镍电流7 5mA,镀镍时间分别为2min、15min、30min、45min或60min;对镀镍基板再进行蚀刻(蚀刻电流7 5mA,蚀刻时间2min)或用氨水浸泡处理(含NH325%,超声振荡30min),然后烘干备用。
6) sputtered atom
溅射原子
1.
Computer simulation of sputtering of target and transportation of sputtered atoms;
靶材溅射及溅射原子输运的计算机模拟
补充资料：初级粒子和原级粒子
分子式：
CAS号：
性质：又称初级粒子和原级粒子。利用各种化学反应方法得到的最初粒子(晶粒)。一次粒子的大小约为0.005～1μm，比筛分的极限小得多，在介质中有相当高的稳定性。
CAS号：
性质：又称初级粒子和原级粒子。利用各种化学反应方法得到的最初粒子(晶粒)。一次粒子的大小约为0.005～1μm，比筛分的极限小得多，在介质中有相当高的稳定性。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条