Some new processes and technologies for electronics finishing were introduced, such as wafer plating, electrochemical mechanical polishing, microelectro-mechanical system plating, copper plating using insoluble anode, platinized niobium electrode, lead and cadmium free eleclroless nickel, recycling of alkaline etching solution and reclaiming system of copper.

Some new processes and technologies in electronics finishing such as wafer plating, eCMP,MEMS plating,lead and cadmium free electroless nickel,copper plating using insoluble anode and recycling of etching solution for PCB industry and platinized niobiumelectrode are briefly introduced.

Recovery of copper from spent etching solution by Lix54-100 extractant;

The earliest domestic originated zero emission clean production process for mass centralized resource utilization of circuit board spent etching solution developed by Nanxi Chemical Plant,Baiyun District of Guangzhou was studied and three key technical conditions were optimized by orthogonal experiment including weight of mixed quicklime of 0.

Factors that may influence copper recovery rate including pH, temperature and cuprous ion concentration were studied when using neutralization process to recover copper from spent etching solution, and options to choose the best conditions for precipitating copper were optimized.

Research Status and Prospects for spent etching solution

There are two different typical treatment technologies in PCB spent etching solution in China now-cyclic regeneration end producing copper sulfate,In the paper,the technology process,resource utilization and environment infection are compared and analyzed between them.

Reuse treatment of spent copper-containing etching solution for printed circuit board—Part Ⅰ