1)  Cu/FeNi
Cu/FeNi
1.
The Cu/FeNi composite with low thermal expansion and high thermal conductivity (high electrical conductivity) has been made by powder metallurgy, which is used as thermal support of semiconductor instead of W or Mo dish.
采用粉末冶金方法,制备了低膨胀高导热Cu/FeNi复合材料,其中FeNi粉末粒度分别为300~150,150~100,100~74μm和小于74μm。
2)  FeNi/Cu/FeNi sandwiched films
FeNi/Cu/FeNi三明治薄膜
3)  sandwiched FeNi/Cu/FeNi films
夹心结构FeNi/Cu/FeNi多层膜
1.
Giant magneto-impedance in sandwiched FeNi/Cu/FeNi films;
夹心结构FeNi/Cu/FeNi多层膜巨磁阻抗效应研究
4)  sandwiched FeNi/Cu/FeNi films
三明治结构FeNi/Cu/FeNi多层膜
1.
Giant magneto-impedance in sandwiched FeNi/Cu/FeNi films;
三明治结构FeNi/Cu/FeNi多层膜巨磁阻抗效应研究
5)  Cu
Cu
1.
Sorption properties of Cu in electroplating wastewater on municipal solid waste incinerator bottom ash;
垃圾焚烧炉渣对电镀废水中Cu的吸附特性
2.
Study on the Influences of Combined Pollution of Heavy Metals Cu and Pb on Soil Respiration;
重金属Cu与Pb复合污染对土壤呼吸影响的研究
3.
BIOACCUMULATION AND TOXICITY OF Cu AND Zn IN HYDRILLA VERTICILLATA(LINN.F.) ROYLE;
Cu、Zn在黑藻叶片中的富集及其毒理学分析
6)  Cu~+
Cu+
1.
Complex ions [Cu(RS)],[Cu(RS)_2]~-and [Cu(RS)_3]~(2-) whose coordination numbers were 1,2 and 3,respectively were formed by the combination of L-cysteine(RSH) in the form of RS~-and Cu~++ in this system.
研究表明,L-半胱氨酸(RSH)以RS-负离子形式和Cu+形成配位数分别为1、2、3的配位离子[Cu(RS)][、Cu(RS)2]-[、Cu(RS)3]2-,它们的稳定常数分别为760,5。
2.
KCl:Cu~++ powder sample was prepared with high temperature solid reaction process.
用固相反应法制备了KCl:Cu+多晶样品。
参考词条
补充资料:A1-Cu-Co合金中十次对称准晶单晶体及其衍射图


A1-Cu-Co合金中十次对称准晶单晶体及其衍射图


  ‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
  
说明:补充资料仅用于学习参考,请勿用于其它任何用途。