1)  laminator
塑封机
1.
The way of making butterfly s specimen in the laminator is shown in this paper.
介绍用塑封机制作蝶类标本的方法，以及制作过程中注意的问题。
2)  index of molding machine performance
塑封机的绩效指标
3)  influence factors of wire bonding machine and molding machine
焊线机和塑封机的影响因素
4)  plastic package
塑封
1.
Development of the automatic loader system for plastic package of integrated circuit;
集成电路塑封自动上料系统的研制
2.
Study on autolead frame load technology for plastic package of integrated circuit;
集成电路塑封自动上片技术的研究
5)  molding
塑封
1.
From the points of view of lead frame design, processing accuracy control, inner packaging material choosing, desired inner packaging shape control, the realizing of molding air-tightness and the perfection of environmental condition, the article discussed the design and process key points on raising the isolation voltage to develop world advanced-level product and to form volume pr.
介绍了研制出其性能达国际先进公司同类产品水平的塑封双列直插式光耦合器的工作原理和提高绝缘耐压的技术难点 ,从引线框架设计、加工精度控制、内包封材料选型、理想内包封形状控制、塑封气密性的实现、环境条件的完善等方面讨论了提高绝缘耐压的设计和工艺要
2.
In this thesis, molding process for a typical TSOP product is studied in detail, and FEA(Finite element analysis) has been applied in this process.
本文采用有限元的方法模拟了典型TSOP封装产品的塑封脱模过程。
6)  plastic package die
塑封模
1.
Design of plastic package die with multi-injection head for integrated circuit;
集成电路多注射头塑封模设计
2.
The difference between ball grid array(BGA) and conventional plastic package die for integrated circuit product was analyzed.
分析了BGA塑封模与传统集成电路产品塑封模的不同点,通过对BGA封装难点的分析,提出了BGA产品封装过程中出现的基板溢料问题的解决方案,并详细介绍了BGA塑封模溢料控制机构和具体实施方法。
参考词条
补充资料：挤塑吹塑
分子式：
CAS号：

性质： 由挤出机挤出管状型坯，并将它垂挂在安装于挤出机头正下方的预先打开的模具型腔中。当下垂的型坯达到合格长度后立即合模，靠模具的切口将管坯切断，然后通过从模具分型面上的小孔插入的压缩空气吹管送入压缩空气，使型坯吹胀紧贴模壁而成型，然后脱模即成制品。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。