1) CMP bin
CMP面元
2) CMP
CMP参考面
1.
Elevation Signification of CMP Reference Surface;
CMP参考面的高程含义分析
3) chemical mechanical planarization(CMP)
化学机械平面抛光(CMP)
4) Copper CMP
铜CMP
1.
Copper CMP Barrier Slurry System for 130nm/90nm New Process Development;
用于130nm/90nm新工艺开发的铜CMP阻挡层磨料系统(英文)
5) SimCMP
Sim-CMP
6) panel method
面元
1.
A panel method is presented for analysis of a partially cavitating axisymmetric body.
基于面元法 ,通过在回转体和空泡壁面放置源汇 ,对回转体定长局部空泡的绕流问题进行计算和分析 ,并讨论了空泡尾部速度过渡闭合模型对绕流计算的影响。
补充资料：5'-cmp
CAS: 63-37-6
分子式: C9H14N3O8P
熔点: 233℃
中文名称: 5'-胞(嘧啶核)苷酸；胞苷-5'-单磷酸一水物
英文名称: 5'-Cytidylic acid；5'-cmp；cmp (nucleotide)；cytidine 5'-(dihydrogenphosphate)；cytidine 5'-monophosphoric acid；cytidine 5'-phosphate；cytidine 5'-phosphoric acid；cytidine monophosphate；cytidylic acid
分子式: C9H14N3O8P
熔点: 233℃
中文名称: 5'-胞(嘧啶核)苷酸；胞苷-5'-单磷酸一水物
英文名称: 5'-Cytidylic acid；5'-cmp；cmp (nucleotide)；cytidine 5'-(dihydrogenphosphate)；cytidine 5'-monophosphoric acid；cytidine 5'-phosphate；cytidine 5'-phosphoric acid；cytidine monophosphate；cytidylic acid
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条