1) micro-electronic materials
微电子材
2) microelectronic materials
微电子材料
1.
The relative motion law of the particles in slurry, with respect to the processed surface of the silicon, during the chemical mechanical planarization (CMP) of microelectronic materials is firstly discussed.
通过研究微电子材料化学机械平坦化(CMP)加工过程中磨料颗粒在晶片加工表面的运动规律,得到磨料颗粒在晶片表面的运动轨迹方程。
2.
The deformation of materials and material removal mechanism during chemical mechanical palnarization (CMP) processing of microelectronic materials are numerically analyzed using finite element method.
采用有限元数值方法分析微电子材料化学机械平坦化(CMP)工艺过程中材料的变形和去除机理,得到作用在磨料颗粒上的力与名义压力、磨粒含量以及垫板几何和力学特性之间的关系,进而建立起一个材料去除率(MRR)模型。
3) micro-nanoelectronics materials
微纳电子材料
1.
With the scaling down of device feature size in integrated circuits (IC), it becomes apparent that the mechanical properties of micro-nanoelectronics materials exert increasingly important impact on the reliability of devices, even to that of the entire circuit.
随着集成电路器件特征尺寸的不断减小,微纳电子材料的力学性能越来越显著地对器件乃至整个电路的可靠性产生重要影响。
4) Micro-electronics Function & Material
微电子功能材料
5) e neutrino
电子微子
6) electronic material
电子材料
1.
Applications of copper plating technology to electronic materials;
电镀铜技术在电子材料中的应用
补充资料：微材
1.见"微才"。 2.细小的材料。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条