1) 300 mm wafer
300mm圆片
2) 300mm wafer line
300mm晶圆线
3) 300mm wafer
300mm晶圆
1.
The use of 300mm wafer is inexorable law for The semiconductor industrydevelopment .
采取300mm晶圆是半导体生产发展的必然规律。
4) 300 mm silicon wafer
300mm硅片
1.
The subsurface damage depth measurement of double side grinding of 300 mm silicon wafer can not only give a correct basis for process improvement and reduce the subsurface damage depth of double side grinding,but also help reduce polishing time to improve geometry parameter of polished wafer.
本文应用恒定腐蚀法和双晶衍射法测量了300mm硅片双面磨削工艺后的损伤层厚度,对恒定腐蚀法进行了较深入的研究,并结合恒定腐蚀法的结果对硅片进行双晶衍射。
2.
A motion model based on the analysis of mathematical modeling was established to study motion path in double-sided polishing process for 300 mm silicon wafers.
优化四个转速,可以显著改善300mm硅片表面的平整度和局部平整度。
5) 300mm CZ silicon wafer
300mm CZ硅片
补充资料：φ300mm-L1000mm真空自耗炉(北京钢铁研究总院)
φ300mm-L1000mm真空自耗炉(北京钢铁研究总院)
。00mm_LIO00mm真空自耗炉(;匕京钢铁研究总院)哪
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条