1) Temperatures of substrates and annealings
基底和退火温度
2) annealing temperature
退火温度
1.
Effect of annealing temperature on the microstructure of rapidly-solidified TiNi-Cu alloy ribbons;
退火温度对Ti_(53.5)Ni_(22.8)Cu_(23.7)合金快速凝固条带组织的影响
2.
Influence of annealing temperature on structure and properties of Al-6Mg-Sc-Zr alloy;
退火温度对Al-6Mg-Sc-Zr合金组织与性能的影响
3.
Effects of annealing temperature on microstructures and properties of the 25Mn-3Si-3Al-TWIP steel;
退火温度对25Mn-3Si-3Al-TWIP钢组织和力学性能的影响
3) anneal temperature
退火温度
1.
Effect of anneal temperature on performance of poly(chloro-p-xylylene)films;
退火温度对聚氯代对二甲苯膜性能的影响
2.
Taking original shape examination as contrast,the HT250 welding strain under three kinds of different anneal temperature(500℃、600℃、650℃)was studied.
以未进行退火处理试件为对比,研究了三种不同的退火温度(500℃、600℃、650℃)对HT250焊接残余应力的影响;对四块试件分别测试了各自的焊接应力,并将测试数据输入计算机得到了不同退火温度下的试件的焊接应力曲线;结果表明:此试验的最佳退火温度为650℃。
3.
The paper studies the effect of different cold deformation and anneal temperature as well as holding time on the material organization and property of alloy pipe 5086,sets the production process system of aluminum alloy 5086 at state of H34.
研究了不同冷变形程度、退火温度与保温时间对5086铝合金管材组织及性能的影响,确定5086铝合金H34状态的生产工艺制度,在工业生产条件下,其产品的技术指标达到了用户要求。
5) annealing temperature T_A
退火温度T_A
6) substrate temperature
基底温度
1.
Influence of the liquid substrate temperature on the band-shaped ordered structures in an Al film system;
液相基底温度对Al薄膜中带状有序结构的影响
2.
The influence of substrate temperature on the crystal orientation,the surface topography and conductivity of TiNx thin films were investigated.
在不同的基底温度下,采用直流磁控反应溅射法在硅基底上制备了氮化钛(TiNx)薄膜,研究了基底温度对薄膜结晶取向、表面形貌和导电性能的影响。
3.
The effect of the substrate temperature and the rest energy of incident particles on the island morphology and size at the early stage of thin film growth are studied by Monte-Carlo simulation.
利用Monte Carlo(MC)方法模拟研究了薄膜生长的初始阶段岛的形貌和岛的尺寸与基底温度和入射粒子剩余能量之间的关系。
补充资料：软化退火(见低温退火)
软化退火(见低温退火)
soft-annealing
rU0nhUO tUihUO软化退火(soft一annealing)见低温退火。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条