1) board-level drop
板级跌落
1.
Lead- free solder joint reliability under board-level drop impact was investigated.
文中引入一块不同于JEDEC标准测试板的圆形测试板,探究板级跌落碰撞下无铅焊点的可靠性。
2) drop
[英][drɔp] [美][drɑp]
跌落
1.
SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years.
针对在跌落碰撞条件下便携式电子产品中SMT连接焊点的可靠性问题,对该领域相关的理论和实验研究成果进行了综述。
2.
By using the Laplace transformation and Simulink, the dynamic characteristics of product under a varies of inputs and drop process are analyzed.
建立了缓冲包装系统的动力学模型，列写了系统在振动、冲击状态下的微分方程，在对微分方程进行拉民变换的基础上，讨论了运用Simulink动态仿真工具来仿真包装件在多种激励下及跌落过程中的动态特性。
3.
The results showed that the damage boundary differs as the orientation changes,and even when the cookies are dropped in the same orientation,the damage rate is not identical.
结果表明,饼干不同方位的破损边界曲线都不相同,且同一方位的跌落下,不同破损率破损边界曲线也不相同。
3) dropping
[英]['drɔpiŋ] [美]['drɑpɪŋ]
跌落
1.
The design of the dropping tester for simple packages;
简易包装件跌落试验机的设计
2.
The properties of the molded pulp cushion were investigated through the vibration and dropping experiments of the signal acquisition instrument package.
通过对信号采集仪包装件进行振动试验和跌落试验,研究了纸浆模塑缓冲衬垫的抗振和缓冲能力。
3.
Smoothed particle hydrodynamics (SPH) method coupled with finite element method (FEM) is used to simulate the dropping of rectangular fluid-filled tank.
采用SPH和FEM耦合的方法,考虑流固耦合效应的影响,对典型矩形薄壁充液容器的跌落过程进行数值仿真。
4) drop impact
跌落冲击
1.
A 3-D FE model was established in order to investigate dynamic responses of the round PCB and find the weakness of solder joint in packaging under drop impact.
针对JEDEC标准板的局限性,设计一种圆形PCB,建立其三维有限元模型,运用ABAQUS有限元分析软件对设计板在跌落冲击载荷下的动态特性进行模拟仿真,找到封装中焊点的薄弱环节,得出焊点的应力状况与PCB板的挠曲变形存在一致的对应关系,验证PCB板在跌落冲击过程中弯曲振动导致的交变应力是焊点破坏的原因。
2.
With increase in electronic package density,the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高,板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
3.
Drop direction is an important parameter of drop impact,this paper presented a new method to measure drop direction and introduced the basic structure,measurement circuit and principle of the sensor.
跌落方位是跌落冲击中的一个重要参数,测量较为困难,提出了一种基于电容传感器的跌落方位现场测试新方案,分析了其基本结构、测量电路、测试原理和方法。
5) drop/impact
跌落/冲击
6) fall strength of briquette
跌落强度
1.
By measuring strength of three kinds of processed briquettes of Jincheng,Jiyuan,Yancheng anthracite,the influence rules that the factors influenced fall strength of briquette are pointed out in this paper.
采用复合添加剂对晋城、济源、阳城3种无烟煤及加工成的型煤进行跌落强度测试,得出了各因素对型煤跌落强度的影响规律。
补充资料：跌落
①（物体）往下掉。②（价格、产量等）下降。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条