Managing Transient Thermal Environments During the Underfill Process

It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill,so it is very important for electronic packaging.

The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.

The experiment results show that using a small amount of nano-particles SiO2,Al2O3 and ZnO can apparently improve the moisture absorption property of underfiller,and particularly,the lowest percentage of moisture absorption can be obtained by filling 3%(by mass) ZnO nano-particles.

Considering the stone quarry environment was complicated,the initiation plan of triangular drilling and diagonal detonation were employed;By choosing reasonable millisecond blasting time and clogged length to effectively control the blasting vibration and flying rocks;the technology of vacuum space blasting was adopted to improve the effect of blasting and leave no bedrock.

The methods and skills of the CorelDRAW X4 texture filling tool for drawing cabochon or bead gemstones,wire and sandblasted effect of metal texture are introduced in detail.

Choice of coal mine partial-filling technology according to balance between mining and filling;

Because of relative high cost of traditional filling,a new concept of the partial-filling and three technical ways are put forward,including the technologies of partial paste filling in goaf,isolated section-grouting for the overburden bed.