1) Temple filling
颞部填充术
2) temporal-augmentation
颞部填充
1.
Methods 11 female patients(26～35 years old) requesting a temporal-augmentation were given a full skull spiral CT scan.
目的:分析要求行颞部填充治疗的女性的颅颌面三维结构,为临床治疗提供依据。
4) partial-filling
部分充填
1.
Choice of coal mine partial-filling technology according to balance between mining and filling;
从采充均衡论煤矿部分充填开采模式的选择
2.
Because of relative high cost of traditional filling,a new concept of the partial-filling and three technical ways are put forward,including the technologies of partial paste filling in goaf,isolated section-grouting for the overburden bed.
针对传统充填开采成本相对偏高的问题,提出了部分充填开采的概念和3项部分充填开采技术,即采空区膏体条带充填技术、覆岩离层分区隔离注浆充填技术、条带开采冒落区注浆充填技术,分别对其技术原理进行了介绍。
5) Partial filling
部分填充
1.
Based on the transverse oscillations and timing structure of bunch pulse that are characteristics in storage ring, it excites the beam to produce the coherent oscillations and then,the electrons of some bunches are destroyed,resulting in a partial filling and uniform filling in storage ring.
介绍了用于电子储存环部分填充和非均匀填充的一种实验装置储存环高频剔除系统 ,它利用储存环中电子运动所具有的横向自由振荡和束团脉冲的时间结构这一特性 ,采用外加激励的方法使其产生共振 ,从而使得储存环中部分束团中的电子丢失 ,形成储存环的部分填充和非均匀填充。
6) underfill
[英]['ʌndəfil] [美]['ʌndɚ,fɪl]
底部填充
1.
Managing Transient Thermal Environments During the Underfill Process
底部填充工艺的瞬时温度环境管理(英文)
2.
It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill,so it is very important for electronic packaging.
有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
3.
The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.
倒装技术是发展的关键技术,它包括再分布技术、凸点底层金属(UBM)技术、凸点制备技术、倒扣焊接技术和底部填充技术等。
补充资料：吻合血管的颞部头皮瓣移植术
吻合血管的颞部头皮瓣移植术
microvascular temporal flap transfer
指一种需要头发移植的皮瓣移植手术。世界上第1例手术由Harii(1972年)首先提出和移植成功，用以修复对侧颞鬓部瘢痕性秃发。其供血血管是头部颞浅动脉和静脉。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条