1) etching curve
蚀刻曲线
2) Etch curve
蚀刻曲线
3) etching
蚀刻
1.
Preparation of metal nanowire arrays with controllable length using a simple etching method;
简单蚀刻法制备具有可控高度的金属纳米线阵列
2.
Effects on Elaborate Etching of Printed Circuit Board;
印刷线路板精细蚀刻的影响因素
3.
Electrochemistry Etching of Brass Superficial Pattern;
黄铜表面图案的电化学蚀刻
4) Etch
蚀刻
1.
A clinical study of tooth hard-tissue etched with pulsed Nd:YAG laser;
脉冲Nd:YAG激光蚀刻牙齿硬组织的临床研究
2.
Quality Control of Etch Produce in VFD Film Plant;
VFD薄膜基板蚀刻工序的质量控制
3.
The surface of epoxy resin-carbon fiber composite is etched by CrO3-H2SO4 solution,and the morphology of the surface of the composite etched is observed by means of SEM.
简介了碳纤维复合材料(CFRP)材料表面金属化的工艺过程,采用CrO3-H2SO4溶液对CFRP进行蚀刻处理,通过扫描电镜观测经蚀刻处理后的树脂表面的微观形貌,测试了镀层附着力,分析了蚀刻程度与镀层附着力之间的关系。
5) Micro-etch
微蚀刻
1.
Comparative Study on Potassium Monopersulfate Compound and Sodium Persulfate in the PCB Micro-etch Field;
过硫酸氢钾复合盐与过硫酸钠在PCB微蚀刻中的对比研究
6) spent etching solution
蚀刻废液
1.
Recovery of copper from spent etching solution by Lix54-100 extractant;
Lix54-100从印刷电路板蚀刻废液中回收铜
2.
The earliest domestic originated zero emission clean production process for mass centralized resource utilization of circuit board spent etching solution developed by Nanxi Chemical Plant,Baiyun District of Guangzhou was studied and three key technical conditions were optimized by orthogonal experiment including weight of mixed quicklime of 0.
对广州市白云区南溪化工厂开发出的一套对线路板蚀刻废液集中资源化处理的零排放处理新工艺的工艺条件进行了深入研究,并通过正交试验的方法,优化了最关键的三个工艺条件,即混合生石灰加入量为碱式氯化铜泥重量的0。
3.
Factors that may influence copper recovery rate including pH, temperature and cuprous ion concentration were studied when using neutralization process to recover copper from spent etching solution, and options to choose the best conditions for precipitating copper were optimized.
研究了中和法回收含铜蚀刻废液中的铜时pH值、温度及亚铜离子含量等因素对回收率的影响,给出了最佳沉淀工艺条件的选择方案。
参考词条
补充资料：蚀刻曲线
分子式：
CAS号：
性质：表征固体核径迹探测器被化学蚀刻蚀去的厚度与垂直入射带电粒子径迹半径的变化关系。典型的蚀刻曲线呈平缓变化的S形曲线，但其前段呈线性。
CAS号：
性质：表征固体核径迹探测器被化学蚀刻蚀去的厚度与垂直入射带电粒子径迹半径的变化关系。典型的蚀刻曲线呈平缓变化的S形曲线，但其前段呈线性。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。