1)  tin-based composites
锡基化合物
2)  tin based
锡基
1.
A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed.
引入了快冷锡基软钎料的浸润性模型，并进行了计算处理。
2.
Studies of tin based anode materials for lithium ion secondary battery have been reviewed.
综述了锂离子蓄电池锡基负极材料的研究。
3)  tin based alloy
锡基合金
1.
The performances of lead-free plating and Sn-Pb alloy plating were contrasted, and the process formulation and operation condition of tin and tin based alloy plating and electroless plating were presented.
对比了电镀无铅镀层和Sn–Pb合金镀层的性能,给出了电镀及化学镀锡及锡基合金的工艺配方及操作条件。
2.
Gas atomizing process has been used for developing SMT purposed raw material tin based alloy soldering powder of free cleaning type soldering paste,the alloy composition and impurity component contents of which have reached US QQ SS 571E and JAP JIS Z 3282A grade standards with oxide contents meeting the standard of US Multicore Co.
采用气体雾化法研制了ＳＭＴ用免清洗型软钎膏的锡基合金焊粉，其合金成分及杂质元素含量达到美国ＱＱ－Ｓ－５７１Ｅ和日本ＪＩＳ－Ｚ－３２８２Ａ级标准，氧化物含量达到美国Ｍｕｌｔｉｃｏｒｅ公司无氧焊粉的标准，一次出粉率平均达到７０％以上。
4)  Tinplate
镀锡基板
1.
Study on Development of MR-2 Tinplate at Meigang;
梅钢MR-2电镀锡基板的开发研究
5)  Tin Solder
锡基焊料
1.
Determination of Stibium in Tin Solder by Flame Atomic Absorption Spectrometry;
火焰原子吸收光谱法测定锡基焊料中锑
6)  Tin-base alloys
锡基合金
1.
25 kinds of the weldable Tin and Tin-base alloys electroplating processes in the nearest 10 years in China were rewiewed systematically and completely.
系统而又比较全面地总结了我国近10年来电镀可焊性锡及锡基合金工艺25种,并指出了每种工艺的镀液性能和镀层质量的优劣,最后提出了可焊性电镀的发展趋势。
参考词条
补充资料：3-[(2-乙基己基)氧基]-1-丙胺的化合物(1:1)
CAS:85443-67-0
分子式: C16H11CrN5O8S·C11H25NO·H
中文名称: [3-[(4,5-二氢-3-甲基-5-氧代-1-苯基-1H-吡唑-4-基)偶氮]-2-羟基-5-硝基苯磺酸根合(3-)]羟基铬酸(1-)氢；3-[(2-乙基己基)氧基]-1-丙胺的化合物(1:1)

英文名称: Chromate(1-), [3-[(4,5-dihydro-3-methyl-5-oxo-1-phenyl-1H-pyrazol-4-yl)azo]-2-hydroxy-5-nitrobenzenesulfonato (3-)]hydroxy-, hydrogen, compd. with 3-[(2-ethylhexyl)oxy]-1-propanamine (1:1)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。