1) reaction curing agent
反应固化剂
2) reactive curing agent
反应型固化剂
3) reactive curing agent
反应性固化剂
4) cure reaction
固化反应
1.
Effect of nano Si_3N_4 on the cure reaction of epoxy resin
纳米氮化硅对环氧树脂固化反应的影响研究
2.
Study on cure reaction of epoxy-phenolic aldehyde resin catalyzed by triphenylphosphine
三苯基膦催化环氧-酚醛树脂的固化反应研究
3.
The cure reaction and thermal properties of a novel dicyanate ester resin containing naphthalene ring were characterized by differential scanning calorimetry(DSC) and thermogravimetric analysis(TGA).
采用差示扫描量热(DSC)和热失重分析(TGA)研究了含萘环结构的氰酸酯树脂的固化反应和耐热性能。
5) curing reaction
固化反应
1.
Study on curing reaction of water borne epoxy resin system;
水性环氧树脂固化反应的研究
2.
Study on the curing reaction and thermal decomposition kinetics of poly(2,6-dimethyl-1,4-phenylene ether)/epoxy systems;
聚苯醚/环氧树脂体系的固化反应和热分解动力学研究
3.
Study on curing reaction and kinetics of modified BMI/benzoxazine resin;
改性BMI/苯并噁嗪树脂的固化反应及其动力学研究
6) co-curing behavior
共固化反应
1.
The co-curing behavior and product structures of the novel bismaleimide and dicyanate blends were studied by the differential scanning calorimetry (DSC) and in-situ FT-IR, and according to the results of the thermogravimetric analysis (TGA) in N2, the thermal properties of bis.
合成出了新型含有萘环和醚键结构的双马来酰亚胺和氰酸酯单体,通过元素分析(EA)、傅立叶变换红外光谱(FT-IR)及核磁共振(1H-NMR)等手段对其进行表征分析,同时,用差示扫描量热法(DSC)、原位FT-IR对新型BMPN/DNCY树脂体系的共固化反应机理以及固化物结构进行了研究,并采用热失重法(TGA)分析该树脂在氮气条件下的耐热性能。
2.
The co-curing behavior and structure of co-curing product of different low brominated epoxy/cyanate ratio were studied by DSC and FTIR, and the properties of their laminates were also discussed.
用差示扫描量热仪(DSC)、傅立叶交换红外光谱(FT-IR)对不同配比的低溴环氧/氰酸酯树脂的共固化反应机理以及固化物的结构特征进行了研究,同时测定和讨论了其层压板的耐热性和介电性能等。
补充资料：120固化剂
N-羟乙基乙二胺又称β-羟乙基乙二胺，俗称120固化剂，结构式H2N(CH2)2NH(CH2)2OH，分子量92．06。无色或淡黄色透明粘性液体，微有氨气味。呈强碱性。有吸湿性。与水、乙醇混溶，微溶于乙酸。能从空气中吸收二氧化碳。低毒．LD504032mg／kg。
用作环氧树脂的室温快速固化剂，参考用量16～18phr，固化条件RT／10h或80℃／3h。
贮存于阴凉、干燥的库房内，防潮。
用作环氧树脂的室温快速固化剂，参考用量16～18phr，固化条件RT／10h或80℃／3h。
贮存于阴凉、干燥的库房内，防潮。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条