2) packaging stress
封装应力
1.
Piezoresistive strain gauge array for packaging stress test;
测试封装应力用压阻式应变计阵列
3) Non-stress packaging
无应力封装
1.
Substrate strengthen design and O rings suspension package realize well effect non-stress packaging.
衬底强化设计和O型圈悬浮封装的巧妙结合实现了无应力封装。
4) assembly with low stress
低应力封装
5) thermally induced package effect
热致封装效应
6) Prestressed Hot Built-Up
预应力热套装
补充资料：轧辊残余应力(见轧辊应力)
轧辊残余应力(见轧辊应力)
residual stresses in roll
zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条