1.
Research of thermal stress and analysis of thermal characteristic for plastic ball grid array package
PBGA封装热应力研究与热特性分析
2.
Thermal Stress Analysis and Optimization of SCSP Chip Package
叠层CSP芯片封装热应力分析与优化
3.
Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;
功率载荷下叠层芯片尺寸封装热应力分析
4.
A Study on Thermal Stress and Invalidation for Chip Scale Package;
芯片尺寸封装（CSP）的热应力及热失效分析研究
5.
Analysis on Thermal Stress and Thermal Reliability of BGA Packaging
BGA封装的热应力分析及其热可靠性研究
6.
Study on Stress-Strain and Thermal Failure of Ball Grid Array Package
球栅阵列封装的应力应变及热失效研究
7.
Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
8.
Research on MEMS Packaging by Induction Heating and Its Applications;
基于感应加热的MEMS封装技术与应用研究
9.
A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor
新型应力不敏感FBG温度传感封装结构
10.
Application of Glass Sealed Technology in Aviation Thermocouple Production
玻璃封装工艺在航空热电偶生产中的应用
11.
hot-sealing film bagged packing machine
热封薄膜袋式包装机
12.
Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint
无铅倒装焊点的热应力与湿热应力分析
13.
Research on Encapsulation Technique of FBG Strain Sensor Under High Strain Working Condition
高应力状态下FBG应变传感器的封装研究
14.
Thermal Analysis of LED Packages based on Heat Pipe Heat Sink
基于热管散热的LED器件封装热分析
15.
The Analysis and Simulation of Temperature Field and Stress Field in an Oil Slurry Heat Exchanger;
油浆蒸汽发生器热应力计算及密封性能研究
16.
Sealing Analysis under Cooling and Heating Cycle for Reactor Pressure Vessel in Nuclear Power Station;
核电站反应堆压力容器冷热态密封分析
17.
Application of Hot-tapping and Plugging Technology to Emergency Repair of Heating Pipeline
带压开孔封堵技术在热力管道抢修的应用
18.
Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging
电磁感应加热尺寸效应及其BGA封装互连新方法特征研究