1) defect level
缺陷层次
2) Minor Deficiency
次要缺陷
3) secondary defect
二次缺陷
1.
The causes of stress and secondary defects were pointed out,the methods to reduce stress and reduce the secondary defects were given,the effects of stress and secondary defects on bipolar transistor parameters performance were analyzed,the approaches how to distinguish these effects produced by stress or secondary defects were proposed.
半导体器件和集成电路中存在着两大类应力,提出了应力及其引起的二次缺陷产生的原因、以及如何减小产生的应力和减少二次缺陷的措施,分析了应力和二次缺陷对双极型晶体管的参数性能的不同影响,以及如何区分产生的这些影响是由何种应力或二次缺陷引起的办法。
5) Lamination defect
分层缺陷
1.
The characteristics, generating process and innuencing ractors of lamination defect of sendfinished pipe are analyzed based on pierced high temperature alloy blank, and the generating mechanism of lamination defect is discussed.
以高温合金管管坯穿孔为基础，对毛管分层缺陷的特征、形成过程及影响因素进行了研究，并讨论了分层缺陷的形成机理。
2.
The results show that the elements segregation was the main reason for the lamination defect During the continuous casting process,inclusions of MnS,TiC,NbC were formed because of elements segregation of S,Mn,Nb,Ti at the center of the steel.
Q345B中厚钢板在拉伸试验后断口出现分层现象,选择分层缺陷严重的部位,采用光学显微镜、扫描电镜、能谱仪等对其显微组织、缺陷形态和微区成分进行了分析。
6) coating defect
涂层缺陷
1.
The effect of coating defect on the permeation behavior of corrosive ions through coatings,coatings degradation,the corrosion behavior of substrates are discussed based on the review of the study field which included coating defects,blistering and wet adhesion etc.
通过对涂层缺陷、涂层起泡、湿附着力等研究领域的回顾 ,讨论了涂层缺陷对腐蚀性介质离子在涂层中的传输行为、涂层失效、基体腐蚀行为等方面的影响。
补充资料：点缺陷(见晶体缺陷)
点缺陷(见晶体缺陷)
point defect
点缺陷point defeet见晶体缺陷。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条