1) semiconductor wafer fabrication system(SWFS)
半导体晶圆制造系统
1.
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system(SWFS),a dynamic bottleneck real-time dispatching(DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性,提出一种动态瓶颈实时派工策略。
2.
According to unique complicated features,this paper proposed a real-time scheduling simulation platform for the semiconductor wafer fabrication system(SWFS) with object-oriented technology.
针对半导体晶圆制造系统(SWFS)的组织构成、加工过程和生产模式的典型特点,以拓展型面向对象Petri网(EOPN)为工具对该复杂系统建立了模型,在准确描述晶圆制造过程的基础上采用面向对象技术设计并开发了一套SWFS实时调度仿真平台。
3.
According to unique features of semiconductor wafer fabrication system(SWFS),such as large scale,multiple re-entrant,and multi-product manufacturing,this paper proposed a new scheduling method by combining decomposition-based method and ant colony optimization(ACO) algorithm.
为了调度具有大规模、多重入、混合型生产等特征的半导体晶圆制造系统,提出一种将基于问题分解的方法与蚁群算法相结合的新的调度方法。
2) semiconductor manufacturing system
半导体制造系统
1.
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
介绍一般半导体制造系统的结构及其信息交互方式,提出一种基于WebService技术上的通信模型,讨论其结构组成并探讨了其相关特点,给出该模型在某刻蚀机生产系统中的一个应用,并对实际生产效果做出了分析。
3) semiconductor wafer fabrication system
晶圆制造系统
1.
Modeling technology for semiconductor wafer fabrication system based on Agent-oriented knowledge colored timed Petri net
基于多代理的知识有色赋时Petri网的晶圆制造系统建模方法
4) Semiconductor Wafer
半导体晶圆
1.
Electroless Ni/Au UBM Process and Equipment For Semiconductor Wafer
半导体晶圆化学镍/金UBM工艺与设备
5) semiconductor bonding wafer
半导体接合晶圆
6) semiconductor manufacturing
半导体制造
1.
Advanced scheduling in WIP management for semiconductor manufacturing;
先进生产调度:半导体制造中的在制品管理(英文)
2.
Based on an analysis of the complex semiconductor manufacturing process scheduling,the existing scheduling sub-problems and their algorithms are summarized.
针对复杂的半导体制造过程调度,在综述现有调度问题及方法的基础上,提出由投料调度、路径调度和两种类型的工件调度共同组成的分层调度结构的思想及方案,继而基于Petri网模型,探讨所提出的分层半导体调度结构基于Petri网模型的实现方法,最后通过仿真对分层调度结构加以应用验证,并总结全文。
3.
Focusing on rescheduling of semiconductor wafer fAbs,the rescheduling framework for semiconductor manufacturing was constructed,which consisted of rescheduling stimulated factors, rescheduling strategy,rescheduling method and rescheduling performance evaluation.
以半导体制造重调度为研究对象,构建了半导体制造重调度体系结构,在此体系结构下,分析了引发半导体制造重调度的因素,提出了相应的重调度策略(何时引发重调度以及引发何种重调度),进一步探讨了重调度方法中的全局修正式重调度方法,给出了基于群体智能的半导体制造重调度模型,建立了用于重调度性能评价的短期性能指标体系。
补充资料：的的圆
1.滚圆貌。
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