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1)  silica-based core
硅基型芯
1.
Several properties of hot-pressing low-temperature firing silica-based core and two general hot-pressing silica-based cores, involving bend strength, hot deformation of core at double-supporting points,collapsibility of potassium hydroxide solution at boiling point 200 ℃, the retained strength of the core under 1600℃ of were tested, and the comparison and analysis of them was made.
测定热压成型低温焙烧硅基型芯和两种普通硅基热压注的几种性能:抗弯强度,双支点高温热变形量,在沸点为200℃氢氧化钾溶液中的溶失性及1600℃高温后残留强度,并将它们做了对比分析。
2)  Silica-based ceramic core
硅基陶瓷型芯
3)  silica-based ceramic mold
硅基陶瓷型
1.
The present investigation is focus on the preparation process of silica-based ceramic mold using silica sol as binder.
主要研究了以硅溶胶为粘结剂的硅基陶瓷型制备工艺。
4)  Al2O3-based ceramic core
Al2O3基陶瓷型芯
1.
Al2O3-based ceramic core materials were prepared by sintering in ordinary pressure.
采用常压烧结制备Al2O3基陶瓷型芯材料,通过XRD,SEM分析表征了材料的成分和内部结构。
5)  Genotype with gene chip
基因芯片分型
6)  SNP mapping array
SNP基因分型芯片
补充资料:9-三甲硅基-6-[(三甲硅基)氧]基-9H-嘌呤
CAS: 17962-89-9
分子式: C11H20N4OSi2

中文名称: 9-三甲硅基-6-[(三甲硅基)氧]基-9H-嘌呤

英文名称: 9-(trimethylsilyl)-6-[(trimethylsilyl)oxy]-9H-Purine
O6,9-bis(Trimethylsilyl) hypoxanthine
9-(trimethylsilyl)-6-[(trimethylsilyl)oxy]-9h-purin
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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