1) temperature in GANTRY
机架温度
2) Shelf-temperature
货架温度
3) shelf thermal front
陆架温度锋
4) housing rigidity
机架刚度
5) frame compliance
机架柔度
1.
From the indentation data, the hardness and modulus of the materials were directly extrapolated without a frame compliance calibration, with an analysis procedure proposed by Oliver and Pharr.
研究发现:对于机架柔度,无需再进行修正;对于压针接触面积,可用相关的方法计算。
补充资料：铂电阻温度表(见电阻温度表)
铂电阻温度表(见电阻温度表)
表。bod旧nZu wendubiao铂电阻温度表见电阻温
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条