1) alumina-silica grain
硅酸铝颗粒
2) ABw-SiO_2 compound
硼酸铝晶须-二氧化硅颗粒复合体
3) compound bismuth aluminate granules
复方铝酸铋颗粒
4) aluminum particle
铝颗粒
1.
Mechanism of shock wave ignition of aluminum particle;
铝颗粒激波点火机制初探
5) a-grain
高铝颗粒
6) SSP
颗粒硅带
1.
QUALITY IMPROVEMENT OF SSP MELTED FROM BACKSIDE;
背面熔化对颗粒硅带表面质量的改善
2.
Substrate materiacs for crystalline silicon thin film solar cells (CSiTF)——the preparation of SSP;
晶体硅薄膜太阳电池的衬底材料——颗粒硅带(SSP)的制备
3.
Poly-silicon thin films were prepared by RTCVD(Rapid Thermal Chemical Vapor Deposition) method with SSP(Silicon Sheet from Powder) as substrates,then the poly-silicon thin film solar cells were developed with th.
并以颗粒硅带(SSP)为衬底,采用快热化学气相沉积(RTCVD)法制备了多晶硅薄膜,随后制得的多晶硅薄膜太阳电池的效率达到6。
补充资料：双(仲丁醇)正硅酸三乙基正硅酸酯铝盐
CAS：68959-06-8
分子式：C14H33AlO6Si
分子质量：352.47
中文名称：双(仲丁醇)正硅酸三乙基正硅酸酯铝盐
英文名称：bis(2-butanolato)(triethyl orthosilicato-O''')-Aluminum
di-sec-Butoxyaluminoxytriethoxysilane
bis(2-butanolato)(triethyl orthosilicato-o''')-aluminum
diethoxysiloxane-s-butylaluminate copolymer
分子式：C14H33AlO6Si
分子质量：352.47
中文名称：双(仲丁醇)正硅酸三乙基正硅酸酯铝盐
英文名称：bis(2-butanolato)(triethyl orthosilicato-O''')-Aluminum
di-sec-Butoxyaluminoxytriethoxysilane
bis(2-butanolato)(triethyl orthosilicato-o''')-aluminum
diethoxysiloxane-s-butylaluminate copolymer
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条