1) St-partiales
颗粒硅
2) SSP
颗粒硅带
1.
QUALITY IMPROVEMENT OF SSP MELTED FROM BACKSIDE;
背面熔化对颗粒硅带表面质量的改善
2.
Substrate materiacs for crystalline silicon thin film solar cells (CSiTF)——the preparation of SSP;
晶体硅薄膜太阳电池的衬底材料——颗粒硅带(SSP)的制备
3.
Poly-silicon thin films were prepared by RTCVD(Rapid Thermal Chemical Vapor Deposition) method with SSP(Silicon Sheet from Powder) as substrates,then the poly-silicon thin film solar cells were developed with th.
并以颗粒硅带(SSP)为衬底,采用快热化学气相沉积(RTCVD)法制备了多晶硅薄膜,随后制得的多晶硅薄膜太阳电池的效率达到6。
3) silicon sheet from powder(SSP)
颗粒带硅
4) Granulated Si-fertilizer
颗粒硅肥
5) silica gel beads
硅胶颗粒
6) silicon grain
硅颗粒
1.
The PN-knot is formed by diffusing and then the silicon grain is welded on a conducting substrate.
5毫米的硅颗粒,经过磷扩散形成PN结,然后将硅颗粒焊接在导电衬底上,用电泳的方法在导电衬底与硅颗粒的缝隙处沉积一层绝缘树脂,使硅颗粒的P型面与N型面互相绝缘,最后在表面沉积一层透明导电层作为收集极。
补充资料：颗粒弥散强化复合氮化硅陶瓷刀具
颗粒弥散强化复合氮化硅陶瓷刀具
颗粒弥散强化复台氯化硅陶瓷刀具
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条