Researches and Development of Borosilicate Glass in LTCC Technology;

Current Status and Developmental Trend of LTCC;

Soldering of SiC particulate reinforced aluminum(Al/SiC) and low temperature co fired ceramic (LTCC) materials;

Research on the low temperature co-fired ceramic material technique;

The Research of Low Temperature Co-fired Ceramic(LTCC) Technology Manufacturing Process

The low temperature co-fired ceramic (LTCC) technique,which is an excellent packaging technique for achieving miniature and chip actualization of electronic components,has become a major method for electronic component integration,and has attracted the attention of many researchers.

Discuss is the development of the low temperature cofired ceramics of series B 2 O 3 -P 2 O 5 -SiO 2 .

Equivalent cavity model based on low temperature cofired ceramics(LTCC) is put forward to realize package of the miniaturized transmission/receive module in Ka band.

This paper reviews the application and research progress of low temperature co-fired ceramics (LTCC)materials.

The low temperature co-fired ceramics(LTCC)technology developed in recent years is an integrat- ed technology of electric components.

A new technology of aqueous tape casting process has been developed to produce borosilicate glass-ceramic based low temperature co-fired ceramics(LTCC) green tapes for its low cost,safety and no toxicity advantage with water-based latex as binder.

Based on the low temperature co-fired ceramic(LTCC)technology,the silicon accelerometer,signal processing circuit,A/D convertor and RS422 interface cell are integrated in it.