1) BaCO3-based low temperature co-sintering ceramic
BaCO3基低温共烧陶瓷
1.
The components’ preparation and the process of packaging used for the BaCO3-based low temperature co-sintering ceramic substrate material were studied.
对用于封装的BaCO3基低温共烧陶瓷基板LTCC材料进行了研究,包括组分配制以及陶瓷制备工艺研究。
2) LTCC substrate
低温共烧陶瓷基板
1.
Effect of barrier of thin-film metallized LTCC substrates on eutectic solder.;
薄膜金属化低温共烧陶瓷基板的阻碍层对共晶焊的影响
3) LTCC
低温共烧陶瓷
1.
Researches and Development of Borosilicate Glass in LTCC Technology;
低温共烧陶瓷用硼硅酸盐玻璃的研究进展
2.
Current Status and Developmental Trend of LTCC;
低温共烧陶瓷的现状和发展趋势
3.
Soldering of SiC particulate reinforced aluminum(Al/SiC) and low temperature co fired ceramic (LTCC) materials;
铝基碳化硅增强材料(Al/SiC)和低温共烧陶瓷(LTCC)的钎焊
4) low temperature co-fired ceramic
低温共烧陶瓷
1.
Research on the low temperature co-fired ceramic material technique;
低温共烧陶瓷材料工艺研究
2.
The Research of Low Temperature Co-fired Ceramic(LTCC) Technology Manufacturing Process
低温共烧陶瓷(LTCC)工艺的研究
3.
The low temperature co-fired ceramic (LTCC) technique,which is an excellent packaging technique for achieving miniature and chip actualization of electronic components,has become a major method for electronic component integration,and has attracted the attention of many researchers.
低温共烧陶瓷(low temperature co-fired ceramic,LTCC)技术是实现电子元件小型化、片式化的一种理想的封装技术,已成为电子元件集成的主要工艺方式,引起了人们的广泛关注。
5) low temperature cofired ceramics
低温共烧陶瓷
1.
Discuss is the development of the low temperature cofired ceramics of series B 2 O 3 -P 2 O 5 -SiO 2 .
讨论B2O3-P2O5-SiO2系低温共烧陶瓷的研究过程。
2.
Equivalent cavity model based on low temperature cofired ceramics(LTCC) is put forward to realize package of the miniaturized transmission/receive module in Ka band.
为了能够在Ka波段采用低温共烧陶瓷(LTCC)技术实现收发组件小型化设计,提出了LTCC无源等效腔体模型。
6) Low temperature Co-fired ceramics
低温共烧陶瓷
1.
This paper reviews the application and research progress of low temperature co-fired ceramics (LTCC)materials.
主要概述了低温共烧陶瓷(Low Temperature Co-fired Ceramics,简称 LTCC)材料的应用和研究现状,认为利用低温共烧陶瓷技术将多种元器件复合或将其集成在多层陶瓷基板中是今后信息功能陶瓷发展的一个重要方向,在我国应大力发展具有自主知识产权的 LTCC 技术。
2.
The low temperature co-fired ceramics(LTCC)technology developed in recent years is an integrat- ed technology of electric components.
低温共烧陶瓷技术是近年发展起来的令人瞩目的整合组件技术,已经成为无源集成的主流技术,成为无源元件领域的发展方向和新元件产业的经济增长点。
3.
A new technology of aqueous tape casting process has been developed to produce borosilicate glass-ceramic based low temperature co-fired ceramics(LTCC) green tapes for its low cost,safety and no toxicity advantage with water-based latex as binder.
为实现硼硅酸盐玻璃陶瓷基低温共烧陶瓷生带材料的低成本、安全无毒化生产,采用以水性乳胶作为粘结剂的水基流延工艺进行制备;采用数字旋转黏度计分别对分散剂、固相、粘结剂含量对浆料黏度的影响进行了研究,利用扫描电镜对烧结前后生带材料的微观形貌进行了分析。
补充资料：陶瓷素烧
陶瓷素烧 未施釉的陶瓷生坯的烧成过程称素烧。施釉后的再烧成则称釉烧。素烧的主要作用是提高坯体的强度以利于装饰等加工过程，减少损耗。古代许多著名陶瓷如唐三彩、耀州瓷、郎窑红、钧红、部分青瓷的瓷胎均经过素烧后再施釉。采用熔点较低的釉时（精陶、骨灰瓷等），为使坯体达到较好的烧结程度，先将生坯在较高温度（1200～1500℃）下素烧，施釉后再用较低温度（950～1050℃）釉烧。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条