1) inversion
[英][ɪn'vɜ:ʃn] [美][ɪn'vɝʃən]
倒装
1.
Rethink over the movement and the inversion;
“移位”与“倒装”再思考
2.
Researches on Inversion in Rhetoric and Transposition in Grammar
修辞学倒装研究与语法学易位研究
3.
This article mainly discusses inversion and ellipsis,the two grammatical rhetoric techniques of an abstract writing of the medical English research paper.
本文主要探讨医学论文英文摘要写作中两种主要的语法修辞手段:倒装和省略。
2) anastrophe
[英][ə'næstrəfi] [美][ə'næstrəfɪ]
倒装
1.
Textual functions of anastrophe from the point of view of thematic structure;
从主位结构再谈倒装的语篇功能
2.
This essay compares the rhetorical question and anastrophe in English and Chinese Language in rhetorical and pragmatics respect.
从修辞和语用的角度,对英语中的rhetorical question,anastrophe和汉语的设问,倒装两种修辞方法,进行了比较。
3.
In the course of English teaching, we have long noticed the following phenomenon: Our students can generally recognize a variety of anastrophe while reading, whereas they seldom consciously put into practice the construction while writing.
在英语教学的过程中,我们早已注意到这样一种现象:我们的学生在阅读过程中,碰到形形色色的倒装时,一般都能加以辨认,但是,在自己动笔写作时,鲜有使用倒装的。
3) flip-chip
倒装
1.
The technologies of serf-aligning and flip-chip are adopted to develop GaN based high-power blue light emission diode(1mmx1mm).
采用一种自对准制造工艺和倒装芯片的装配技术,研制出GaN基蓝光大功率发光二极管(1mm×1mm)。
4) flip-chip
倒装片
1.
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
文章通过试验证明:纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
5) flip chip
倒装片
1.
This text introduces the technology of flip chip,from origins to the development of now,then an evaluation of the advantage in craft and electricity aspectses is made.
文章主要介绍了倒装片技术从起源到现在的发展状况,并对倒装片的工艺优点及电气方面的优点作出评价,提出倒装片将成为今后大型计算机组装工艺中的关键技术。
2.
The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
文章讨论了引线键合芯片与板上或有机基板上焊料凸点式倒装片的成本比较问题。
6) flip chip
倒装焊
1.
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
2.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
3.
The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;
倒装焊微电子封装结构参数的概率设计
补充资料：倒装
用颠倒词序来加强语气、协调音节或错综句法的修辞格。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条