1.
Comprehensive Comparison Between FC and CSP and Their Development Anticipation
倒装片封装与芯片规模封装的综合比较及其发展前景
2.
An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术
3.
Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段
4.
Bumping Technology for MEMS Flip Chip Packaging;
MEMS封装中的倒装芯片凸点技术
5.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
6.
Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
7.
Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究
8.
Design and Simulation of Pre-bonding System of Flip Chip Equipment for RFID Packaging;
RFID倒装键合机预贴片系统设计与仿真
9.
Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计
10.
Thermal Design of Integrated Power Electronics Module Using Flip-Chip Technology
倒装芯片集成电力电子模块的热设计
11.
Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究
12.
Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料—各向异性导电胶的研究进展
13.
Research on Alignment Methods and Optical Systems for Automatic Flip Chip Bonders
自动倒装贴片机对准方法研究及光路设计
14.
The Processes Parameter Controlling of Non-flow Battom Soldering Paste of the FCB Compositon
倒装芯片结构中不流动底部填充工艺参数
15.
Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度
16.
The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究
17.
Modeling of parasitic parameters for integrated power electronics module using flip chip technology
倒装芯片集成电力电子模块寄生参数的建模
18.
Before rewind film, turn the rewind knob.
要倒片时，转动倒片钮。