1) copper plating
镀铜丝
2) copper plating
镀铜
1.
Neutral non-cyanide copper plating on steel;
钢铁基体上中性无氰镀铜
2.
Roughening process of wrought rolled copper foil used for PCB by copper plating method;
印制板用压延铜箔镀铜粗化工艺
3.
Analytical determination and adjustment of chloride ion in acid copper plating bath;
酸性镀铜镀液中氯离子的分析测定及调整方法
3) Cu plating
镀铜
1.
The surface action mechanism of sodium polydithio dipropyl sulfonate in acidic Cu plating bath indicates that the surface complex produced by adsorbed sodium polydithio dipropyl sulfonate and Cu + resists copper ions’ electrodeposition.
酸性镀铜溶液中表面活性剂聚二硫二丙烷磺酸钠的表面作用机理表现为：吸附态的聚二硫二丙烷磺酸钠与Ｃｕ＋形成表面络合物阻化铜离子的电沉积。
4) copper-plating
镀铜
1.
The copperplating process of graphite powder was investigated and the optimum process parameters were obtained by comparing the copper-plating results.
对石墨粉末的化学镀、电镀及复合镀等镀铜方法进行比较,优化出石墨粉末镀铜的最优方法,并在镀铜工艺上进行了研究,实验表明,通过采用改善石墨粉末分散性的活化剂及优化纯化剂,可提高镀铜层的厚度、连续性及镀层的耐蚀性。
2.
his paper instroduces an anticarbonized copper-plating process with highcurrent efficience and high ductility.
本文介绍了一种高效率、高韧性、防渗碳镀铜工艺，可以大辐度提高铜镀层的沉积速度，降低铜层孔隙率，提高产品合格率，具有显著的经济效益和社会效益。
5) Copper plating/Electroless Copper plating
镀铜/化学镀铜
6) copper electroplating
电镀铜
1.
The composite coating was prepared on an aluminum alloy by anodizing,copper electroplating and chemical plating Ni-P.
先将铝合金样品阳极氧化30 min,然后电镀铜5 min,最后化学镀镍30 min,可以在铝合金表面获得颜色稳定、结合性能良好的复合层,且复合层致密,厚度可达20μm以上,复合层的硬度HV0。
2.
A new method for copper electroplating was established by introducing alternating current overlapped with direct current to replace conventional direct current power source,aiming at increasing the current efficiency and breakthrough the bottleneck of limit current density.
在原直流电镀铜工艺的基础上,将直流电源改为交直流叠加电源进行电镀,建立了一种电镀铜的新办法,以求突破极限电流密度的限制,提高电镀效率。
3.
Two processes including direct electroless nickel plating and electroless nickel plating after a prior copper electroplating on AiSiMg alloy were studied.
研究了在铝硅镁合金基体上直接化学镀镍和在基体上电镀铜后再化学镀镍2种工艺。
参考词条
补充资料：铜丝
1.用铜拉制成的线状成品。电机线圈﹑工业用筛等多用铜丝制成。 2.用铜丝绞制的缆绳。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。